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Design, manufacturing and packaging of high frequency micro ultrasonic transducers for medical applications

Design, manufacturing and packaging of high frequency micro ultrasonic transducers for medical applications

Research output: Chapter in Book/Report/Conference proceedingOther chapter contribution

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Authors

  • J. H.-G. Ng
  • R. T. Ssekitoleko
  • D. Flynn
  • R. W. Kay
  • C. E. M. Demore
  • S. Cochran
  • M. P. Y. Desmulliez

Info

Original languageEnglish
Title of host publicationEPTC 2011
Subtitle of host publicationIEEE 13th Electronics Packaging Technology Conference
PublisherIEEE Computer Society
Pages93-98
Number of pages6
ISBN (Electronic)978-1-4577-1981-3
ISBN (Print)978-1-4577-1983-7
DOIs
StatePublished - 2011

Conference

Conference13th IEEE Electronics Packaging Technology Conference
CountrySingapore
Period7/12/119/12/11
Internet address

Abstract

The challenges for the realization of a miniaturized high frequency ultrasonic transducer linear array lie in the interconnections on the fine pitch piezoceramic elements. Within the footprint the size of a needle, only peripheral interconnections can be allowed on the transducer array such that the acoustic operations on both faces of the vibrating piezoelectric elements are not obstructed. The very low maximum processing temperature allowed also poses difficulty for conventional bonding techniques. This article presents 3-dimensional packaging using spirally rolled flexible circuits, room-temperature anisotropic conductive bonding and stencil printing for the setup of a wafer-level production process flow. © 2011 IEEE.

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