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Design, manufacturing and packaging of high frequency micro ultrasonic transducers for medical applications

Design, manufacturing and packaging of high frequency micro ultrasonic transducers for medical applications

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Authors

  • J. H.-G. Gigg
  • R. T. Ssekitoleko
  • D. Flynn
  • R. W. Kay
  • C. E. M. Demore
  • S. Cochran
  • M. P. Y. Desmulliez

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    Info

    Original languageEnglish
    TitleEPTC 2011
    SubtitleIEEE 13th Electronics Packaging Technology Conference
    PublisherIEEE Computer Society
    Publication date2011
    Pages93-98
    Number of pages6
    ISBN (Electronic)978-1-4577-1981-3
    ISBN (Print)978-1-4577-1983-7
    DOIs
    StatePublished

    Conference

    Conference13th IEEE Electronics Packaging Technology Conference
    CountrySingapore
    Period7/12/119/12/11
    Internet addresshttp://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=6178148

    Abstract

    The challenges for the realization of a miniaturized high frequency ultrasonic transducer linear array lie in the interconnections on the fine pitch piezoceramic elements. Within the footprint the size of a needle, only peripheral interconnections can be allowed on the transducer array such that the acoustic operations on both faces of the vibrating piezoelectric elements are not obstructed. The very low maximum processing temperature allowed also poses difficulty for conventional bonding techniques. This article presents 3-dimensional packaging using spirally rolled flexible circuits, room-temperature anisotropic conductive bonding and stencil printing for the setup of a wafer-level production process flow. © 2011 IEEE.

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