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Design, manufacturing and packaging of high frequency micro ultrasonic transducers for medical applications

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Design, manufacturing and packaging of high frequency micro ultrasonic transducers for medical applications. / Ng, J. H.-G.; Ssekitoleko, R. T.; Flynn, D.; Kay, R. W.; Demore, C. E. M.; Cochran, S.; Desmulliez, M. P. Y.

EPTC 2011: IEEE 13th Electronics Packaging Technology Conference . IEEE Computer Society, 2011. p. 93-98.

Research output: Chapter in Book/Report/Conference proceedingOther chapter contribution

Harvard

Ng, JH-G, Ssekitoleko, RT, Flynn, D, Kay, RW, Demore, CEM, Cochran, S & Desmulliez, MPY 2011, 'Design, manufacturing and packaging of high frequency micro ultrasonic transducers for medical applications'. in EPTC 2011: IEEE 13th Electronics Packaging Technology Conference . IEEE Computer Society, pp. 93-98, 13th IEEE Electronics Packaging Technology Conference, Singapore, 7-9 December., 10.1109/EPTC.2011.6184393

APA

Ng, J. H-G., Ssekitoleko, R. T., Flynn, D., Kay, R. W., Demore, C. E. M., Cochran, S., & Desmulliez, M. P. Y. (2011). Design, manufacturing and packaging of high frequency micro ultrasonic transducers for medical applications. In EPTC 2011: IEEE 13th Electronics Packaging Technology Conference . (pp. 93-98). IEEE Computer Society. 10.1109/EPTC.2011.6184393

Vancouver

Ng JH-G, Ssekitoleko RT, Flynn D, Kay RW, Demore CEM, Cochran S et al. Design, manufacturing and packaging of high frequency micro ultrasonic transducers for medical applications. In EPTC 2011: IEEE 13th Electronics Packaging Technology Conference . IEEE Computer Society. 2011. p. 93-98. Available from: 10.1109/EPTC.2011.6184393

Author

Ng, J. H.-G.; Ssekitoleko, R. T.; Flynn, D.; Kay, R. W.; Demore, C. E. M.; Cochran, S.; Desmulliez, M. P. Y. / Design, manufacturing and packaging of high frequency micro ultrasonic transducers for medical applications.

EPTC 2011: IEEE 13th Electronics Packaging Technology Conference . IEEE Computer Society, 2011. p. 93-98.

Research output: Chapter in Book/Report/Conference proceedingOther chapter contribution

Bibtex - Download

@inbook{a3112507baff4f3e910730159ff2858f,
title = "Design, manufacturing and packaging of high frequency micro ultrasonic transducers for medical applications",
publisher = "IEEE Computer Society",
author = "Ng, {J. H.-G.} and Ssekitoleko, {R. T.} and D. Flynn and Kay, {R. W.} and Demore, {C. E. M.} and S. Cochran and Desmulliez, {M. P. Y.}",
year = "2011",
doi = "10.1109/EPTC.2011.6184393",
isbn = "978-1-4577-1983-7",
pages = "93-98",
booktitle = "EPTC 2011",

}

RIS (suitable for import to EndNote) - Download

TY - CHAP

T1 - Design, manufacturing and packaging of high frequency micro ultrasonic transducers for medical applications

A1 - Ng,J. H.-G.

A1 - Ssekitoleko,R. T.

A1 - Flynn,D.

A1 - Kay,R. W.

A1 - Demore,C. E. M.

A1 - Cochran,S.

A1 - Desmulliez,M. P. Y.

AU - Ng,J. H.-G.

AU - Ssekitoleko,R. T.

AU - Flynn,D.

AU - Kay,R. W.

AU - Demore,C. E. M.

AU - Cochran,S.

AU - Desmulliez,M. P. Y.

PB - IEEE Computer Society

PY - 2011

Y1 - 2011

N2 - The challenges for the realization of a miniaturized high frequency ultrasonic transducer linear array lie in the interconnections on the fine pitch piezoceramic elements. Within the footprint the size of a needle, only peripheral interconnections can be allowed on the transducer array such that the acoustic operations on both faces of the vibrating piezoelectric elements are not obstructed. The very low maximum processing temperature allowed also poses difficulty for conventional bonding techniques. This article presents 3-dimensional packaging using spirally rolled flexible circuits, room-temperature anisotropic conductive bonding and stencil printing for the setup of a wafer-level production process flow. © 2011 IEEE.

AB - The challenges for the realization of a miniaturized high frequency ultrasonic transducer linear array lie in the interconnections on the fine pitch piezoceramic elements. Within the footprint the size of a needle, only peripheral interconnections can be allowed on the transducer array such that the acoustic operations on both faces of the vibrating piezoelectric elements are not obstructed. The very low maximum processing temperature allowed also poses difficulty for conventional bonding techniques. This article presents 3-dimensional packaging using spirally rolled flexible circuits, room-temperature anisotropic conductive bonding and stencil printing for the setup of a wafer-level production process flow. © 2011 IEEE.

U2 - 10.1109/EPTC.2011.6184393

DO - 10.1109/EPTC.2011.6184393

M1 - Other chapter contribution

SN - 978-1-4577-1983-7

BT - EPTC 2011

T2 - EPTC 2011

SP - 93

EP - 98

ER -

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