Jones, Thomas

Dr, Dr.

  • 43 Citations
  • 4 h-Index
20132020

Research output per year

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Research Output

  • 43 Citations
  • 4 h-Index
  • 14 Article
  • 3 Conference contribution
  • 2 Paper
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Article
2020

Analysis of throwing power for megasonic assisted electrodeposition of copper inside THVs

Jones, T. D. A., Bernassau, A. L., Flynn, D., Price, D., Beadel, M. & Desmulliez, M. P. Y., May 2020, In : Ultrasonics. 104, p. 1-9 9 p., 106111.

Research output: Contribution to journalArticle

Spinach-based photo-catalyst for selective plating on polyimide-based substrates for micro-patterning circuitry

Marques-Hueso, J., Jones, D. T. D. A., Watson, D. E., Ryspayeva, A., Esfahani, M. N., Shuttleworth, M. P., Harris, R. A., Kay, R. W. & Desmulliez, M. P. Y., Jan 2020, In : Chemical Engineering Research & Design. 153, p. 839-848 10 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)
2019

A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applications

Ryspayeva, A., Jones, T. D. A., Esfahani, M. N., Shuttleworth, M. P., Harris, R. A., Kay, R. W., Desmulliez, M. P. Y. & Marques-Hueso, J., 15 Mar 2019, In : Microelectronic Engineering. 209, p. 35-40 6 p.

Research output: Contribution to journalArticle

Open Access
File
4 Citations (Scopus)
16 Downloads (Pure)

Direct metallisation of polyetherimide substrates by activation with different metals

Jones, T., Ryspayeva, A., Esfahani, M. N., Shuttleworth, M. P., Harris, R. A., Kay, R. W., Desmulliez, M. P. Y. & Marques-Hueso, J., 25 Feb 2019, In : Surface & Coatings Technology. 360, p. 285-296 12 p.

Research output: Contribution to journalArticle

2 Citations (Scopus)

Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocomposite

Ryspayeva, A., Jones, T. D. A., Esfahani, M. N., Shuttleworth, M. P., Harris, R. A., Kay, R. W., Desmulliez, M. P. Y. & Marques-hueso, J., Apr 2019, In : IEEE Transactions on Electron Devices. 66, 4, p. 1843-1848 6 p., 8643047.

Research output: Contribution to journalArticle

Open Access
File
1 Citation (Scopus)
118 Downloads (Pure)

Selective Metallization of 3D Printable Thermoplastic Polyurethanes

Ryspayeva, A., Jones, T. D. A., Khan, S. R., Nekouie Esfahani, M., Shuttleworth, M. P., Harris, R. A., Kay, R. W., Desmulliez, M. P. Y. & Marques-Hueso, J., 14 Aug 2019, In : IEEE Access. 7, 2019, 9 p.

Research output: Contribution to journalArticle

Open Access
File
78 Downloads (Pure)
2018

A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimide

Marques-Hueso, J., Jones, T. D. A., Watson, D. E. G., Ryspayeva, A., Nekouie Esfahani, M., Shuttleworth, M. P., Harris, R. A., Kay, R. W. & Desmulliez, M. P. Y., 7 Feb 2018, In : Advanced Functional Materials. 28, 6, 8 p., 1704451.

Research output: Contribution to journalArticle

Open Access
File
12 Citations (Scopus)
129 Downloads (Pure)

Copper electroplating of PCB interconnects using megasonic acoustic streaming

Jones, T., Bernassau, A., Flynn, D., Price, D., Beadel, M. & Desmulliez, M. P. Y., 1 Apr 2018, In : Ultrasonics Sonochemistry. 42, p. 434-444 11 p.

Research output: Contribution to journalArticle

7 Citations (Scopus)

Flexible Electronics: A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimide

Marques-Hueso, J., Jones, T. D. A., Watson, D. E., Ryspayeva, A., Nekouie Esfahani, M., Shuttleworth, M. P., Harris, R. A., Kay, R. W. & Desmulliez, M. P. Y., 5 Feb 2018, In : Advanced Functional Materials. 28, 6, 1 p., 1870041.

Research output: Contribution to journalArticle

Open Access
2017

MACFEST: Benchmarking a new solder-able finish for the PCB industry

Jones, T., 2017, In : Journal of the Institute of Circuit Technology. 10, 1, p. 13-19 7 p.

Research output: Contribution to journalArticle

Megasound acoustic agitation for enhanced copper electrodeposition in via interconnects

Jones, T., Flynn, D., Desmulliez, M. P. Y. & Price, D., 1 Jun 2017, In : Journal of the Institute of Circuit Technology. 10, 3, p. 7-14 8 p.

Research output: Contribution to journalArticle

2016

Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation

Jones, T., Flynn, D., Desmulliez, M. P. Y., Price, D., Beaded, M., Strusevich, N., Patel, M. K., Bailey, C. & Costello, S., 2016, In : Circuit World. 42, 3, p. 127-140 14 p.

Research output: Contribution to journalArticle

6 Citations (Scopus)
2015

Implementing new surface pre-treatment processes in the PCB industry through the application of acoustic agitation

Jones, T., Flynn, D., Desmulliez, M. P. Y., Beadel, M. & Price, D., 2015, In : Journal of the Institute of Circuit Technology. 8, 1, p. 10-16 7 p.

Research output: Contribution to journalArticle

2013

Electroplating for high aspect ratio vias in PCB manufacturing: Enhancement capabilities of acoustic streaming

Strusevich, N., Desmulliez, M. P. Y., Abraham, E., Flynn, D., Jones, T., Patel, M. & Bailey, C., 1 Jan 2013, In : Advances in Manufacturing. 1, 3, p. 211-217 7 p.

Research output: Contribution to journalArticle

7 Citations (Scopus)