IEEE IES (Industrial Electronics Society) SYPA (Student and Young Professional) Award year 2018

  • Hakam, D. (Recipient)

Prize: Prize (including medals and awards)


top ten best-qualified papers according to the reviews scores. Granted accommodation, transportation, and conference fee reimbursement.
Degree of recognitionInternational
Granting Organisations

Awarded at event

Event title19th IEEE International Conference on Industrial Technology, 2018. Organiser: IEEE
LocationCentre de Congrès, Lyon, France
Period20 Feb 2018 → 22 Feb 2018