1-3 Piezocomposite design optimised for high frequency kerfless transducer arrays

C.E.M. Démoré, S. Cochran, L. Garcia-Gancedo, F. Dauchy, T.W. Button, J.C. Bamber

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    9 Citations (Scopus)
    470 Downloads (Pure)

    Abstract

    Piezocomposites that can operate at frequencies above 30 MHz without spurious modes are required in order to develop sufficiently sensitive high frequency arrays for high resolution imaging. However, scaling down of conventional piezocomposite fabrication techniques becomes increasingly difficult as dimensions decrease with increasing frequency. The approach presented here is to use micro-moulded 1-3 piezocomposites and a distribution of piezoelectric segment size and separation. Innovative approaches to composite pattern design, based on a randomized spatial distribution, are presented. Micro-moulding techniques are shown to be suitable for fabricating composites with dimensions required for high frequency composites. Randomized piezocomposite patterns are modeled and are shown to suppress spurious modes.
    Original languageEnglish
    Title of host publicationProceedings of the 2009 IEEE Ultrasonics Symposium
    PublisherIEEE Computer Society
    ISBN (Electronic)9781424443901
    ISBN (Print)9781424443895
    DOIs
    Publication statusPublished - 2009
    Event2009 IEEE International Ultrasonics Symposium (IUS) - Rome, Italy
    Duration: 20 Sep 200923 Sep 2009
    http://ewh.ieee.org/conf/ius_2009/

    Conference

    Conference2009 IEEE International Ultrasonics Symposium (IUS)
    Abbreviated title2009 IEEE IUS
    CountryItaly
    CityRome
    Period20/09/0923/09/09
    Internet address

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  • Cite this

    Démoré, C. E. M., Cochran, S., Garcia-Gancedo, L., Dauchy, F., Button, T. W., & Bamber, J. C. (2009). 1-3 Piezocomposite design optimised for high frequency kerfless transducer arrays. In Proceedings of the 2009 IEEE Ultrasonics Symposium IEEE Computer Society. https://doi.org/10.1109/ULTSYM.2009.5442007