A microstructure for detecting the stress distribution in thin coatings deposited on to silicon substrates

Robert P. Keatch; Brian Lawrenson

doi:10.1016/0026-2692(94)90086-8

A microstructure for detecting the stress distribution in thin coatings deposited on to silicon substrates

Robert P. Keatch, Brian Lawrenson

Research output: Contribution to journal › Article › peer-review

8 Citations (Scopus)

Abstract

A microscopic gauge is described which may be used for detecting and measuring the stress which is present in thin coatings which are deposited on to silicon substrates. An array of these structures may be formed on the substrate by means of microengineering fabrication processes, and this enables the uniformity of the stress to be mapped. Evaluation is made from an SEM photomicrograph.

Original language	English
Pages (from-to)	393-400
Number of pages	8
Journal	Microelectronics Journal
Volume	25
Issue number	5
DOIs	https://doi.org/10.1016/0026-2692(94)90086-8
Publication status	Published - 1994

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10.1016/0026-2692(94)90086-8

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title = "A microstructure for detecting the stress distribution in thin coatings deposited on to silicon substrates",

abstract = "A microscopic gauge is described which may be used for detecting and measuring the stress which is present in thin coatings which are deposited on to silicon substrates. An array of these structures may be formed on the substrate by means of microengineering fabrication processes, and this enables the uniformity of the stress to be mapped. Evaluation is made from an SEM photomicrograph.",

author = "Keatch, {Robert P.} and Brian Lawrenson",

year = "1994",

doi = "10.1016/0026-2692(94)90086-8",

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AU - Keatch, Robert P.

AU - Lawrenson, Brian

PY - 1994

Y1 - 1994

N2 - A microscopic gauge is described which may be used for detecting and measuring the stress which is present in thin coatings which are deposited on to silicon substrates. An array of these structures may be formed on the substrate by means of microengineering fabrication processes, and this enables the uniformity of the stress to be mapped. Evaluation is made from an SEM photomicrograph.

AB - A microscopic gauge is described which may be used for detecting and measuring the stress which is present in thin coatings which are deposited on to silicon substrates. An array of these structures may be formed on the substrate by means of microengineering fabrication processes, and this enables the uniformity of the stress to be mapped. Evaluation is made from an SEM photomicrograph.

UR - http://discovery.dundee.ac.uk/portal/en/research/a-microstructure-for-detecting-the-stress-distribution-in-thin-coatings-deposited-on-to-silicon-substrates(74260215-f9fe-407a-a522-263ceb648b35).html

U2 - 10.1016/0026-2692(94)90086-8

DO - 10.1016/0026-2692(94)90086-8

M3 - Article

SN - 0026-2692

VL - 25

SP - 393

EP - 400

JO - Microelectronics Journal

JF - Microelectronics Journal

IS - 5

ER -

A microstructure for detecting the stress distribution in thin coatings deposited on to silicon substrates

Abstract

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