A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applications

Assel Ryspayeva, Thomas D.A. Jones, Mohammadreza Nekouie Esfahani, Matthew P. Shuttleworth, Russell A. Harris, Robert W. Kay, Marc P.Y. Desmulliez, Jose Marques-Hueso

Research output: Contribution to journalArticle

Abstract

Metallization of a polydimethylsiloxane (PDMS)-based substrate is a challenge due to the difficulties in forming crack-free polymer and metal features using standard deposition techniques. Frequently, additional adhesion layers, rigid substrates, multiple processing steps (lift-off and etching) and expensive metal sputtering techniques are required, to achieve such metal patterns. This work presents a novel and rapid technique for the direct metallization of PDMS substrates using photolithography and electroless copper plating. The method has the advantage of not requiring expensive vacuum processing or multiple metallization steps. Electroless copper layer is demonstrated to have a strong adhesion to PDMS substrate with a high conductivity of (3.6 ± 0.7) × 107 S/m, which is close to the bulk copper (5.9 × 107 S/m). The copper-plated PDMS substrate displays mechanical and electrical stability whilst undergoing stretching deformations up to 10% due to applied strain. A functional electronic circuit was fabricated as a demonstration of the mechanical integrity of the copper-plated PDMS after bending.

Original languageEnglish
Pages (from-to)35-40
Number of pages6
JournalMicroelectronic Engineering
Volume209
DOIs
Publication statusPublished - 15 Mar 2019

Fingerprint

copper
electronics
adhesion
metals
photolithography
plating
integrity
cracks
sputtering
etching
conductivity
vacuum
polymers

Keywords

  • Copper-plated PDMS
  • Direct metallization
  • Electroless plating
  • Flexible electronics
  • Stretchable electronics

Cite this

Ryspayeva, A., Jones, T. D. A., Esfahani, M. N., Shuttleworth, M. P., Harris, R. A., Kay, R. W., ... Marques-Hueso, J. (2019). A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applications. Microelectronic Engineering, 209, 35-40. https://doi.org/10.1016/j.mee.2019.03.001
Ryspayeva, Assel ; Jones, Thomas D.A. ; Esfahani, Mohammadreza Nekouie ; Shuttleworth, Matthew P. ; Harris, Russell A. ; Kay, Robert W. ; Desmulliez, Marc P.Y. ; Marques-Hueso, Jose. / A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applications. In: Microelectronic Engineering. 2019 ; Vol. 209. pp. 35-40.
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Ryspayeva, A, Jones, TDA, Esfahani, MN, Shuttleworth, MP, Harris, RA, Kay, RW, Desmulliez, MPY & Marques-Hueso, J 2019, 'A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applications', Microelectronic Engineering, vol. 209, pp. 35-40. https://doi.org/10.1016/j.mee.2019.03.001

A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applications. / Ryspayeva, Assel; Jones, Thomas D.A.; Esfahani, Mohammadreza Nekouie; Shuttleworth, Matthew P.; Harris, Russell A.; Kay, Robert W.; Desmulliez, Marc P.Y.; Marques-Hueso, Jose.

In: Microelectronic Engineering, Vol. 209, 15.03.2019, p. 35-40.

Research output: Contribution to journalArticle

TY - JOUR

T1 - A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applications

AU - Ryspayeva, Assel

AU - Jones, Thomas D.A.

AU - Esfahani, Mohammadreza Nekouie

AU - Shuttleworth, Matthew P.

AU - Harris, Russell A.

AU - Kay, Robert W.

AU - Desmulliez, Marc P.Y.

AU - Marques-Hueso, Jose

PY - 2019/3/15

Y1 - 2019/3/15

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AB - Metallization of a polydimethylsiloxane (PDMS)-based substrate is a challenge due to the difficulties in forming crack-free polymer and metal features using standard deposition techniques. Frequently, additional adhesion layers, rigid substrates, multiple processing steps (lift-off and etching) and expensive metal sputtering techniques are required, to achieve such metal patterns. This work presents a novel and rapid technique for the direct metallization of PDMS substrates using photolithography and electroless copper plating. The method has the advantage of not requiring expensive vacuum processing or multiple metallization steps. Electroless copper layer is demonstrated to have a strong adhesion to PDMS substrate with a high conductivity of (3.6 ± 0.7) × 107 S/m, which is close to the bulk copper (5.9 × 107 S/m). The copper-plated PDMS substrate displays mechanical and electrical stability whilst undergoing stretching deformations up to 10% due to applied strain. A functional electronic circuit was fabricated as a demonstration of the mechanical integrity of the copper-plated PDMS after bending.

KW - Copper-plated PDMS

KW - Direct metallization

KW - Electroless plating

KW - Flexible electronics

KW - Stretchable electronics

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VL - 209

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EP - 40

ER -

Ryspayeva A, Jones TDA, Esfahani MN, Shuttleworth MP, Harris RA, Kay RW et al. A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applications. Microelectronic Engineering. 2019 Mar 15;209:35-40. https://doi.org/10.1016/j.mee.2019.03.001