Abstract
A method and apparatus for metalizing a substrate by heating and applying a voltage across an ion exchange substrate to embed metallic ions from a metallic layer within the ion exchange substrate by a process of ion exchange. The resultant as-diffused substrate has metallic ions are distributed substantially homogeneously across the substrate. This may be metalized by applying a pulsed laser beam to a surface of the as-diffused substrate at or near a concentration of metallic ions such that the energy of the o laser causes the conversion of the metallic ions in the as-diffused substrate into metal atoms at or near the point at which the laser pulse is incident upon the as-diffused substrate thereby creating a metalized substrate with a surface pattern defined by the movement of the laser beam across the surface of the as-diffused substrate.
| Original language | English |
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| Patent number | WO/2013/107996 A1 |
| IPC | C03C 21/00 (2006.01) |
| Priority date | 19/01/12 |
| Filing date | 14/09/12 |
| Publication status | Published - 25 Jul 2013 |