Analysis of thermal mixing in T-junctions using fluid-structure interaction

Andrew R. Gow, Salim M. Salim

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    169 Downloads (Pure)

    Abstract

    T-junctions are present in a wide range of industry and facilitate the mixing of fluids that are often at different temperatures. Temperature fluctuations introduced during the mixing process can result in thermal fatigue and consequently structural failure in the pipework. Predicting the magnitudes and locations of the stresses allows one to prevent and/or mitigate potential issues. A number of studies have investigated the fluid dynamics of T-junctions but very few have researched the impacts of the resulting flow field on the enveloping pipe materials especially where temperature fluctuations are significant. The present study employs steady-state one-way fluid-structure interaction analysis to determine the stress response of the pipework in a thermal-mixing T-junction situation. Firstly, the numerical flow field is simulated using CFD and validated against experimental data. Then, the effects of the fluid force fields on the pipe walls are modelled using structural analysis to predict the resulting stresses.

    Original languageEnglish
    Title of host publicationProceedings of the International MultiConference of Engineers and Computer Scientists 2018, IMECS 2018
    EditorsOscar Castillo, David Dagan Feng, A.M. Korsunsky, Craig Douglas, S. I. Ao
    PublisherNewswood Limited
    ISBN (Electronic)9789881404886
    Publication statusPublished - 14 Mar 2018
    Event2018 International MultiConference of Engineers and Computer Scientists, IMECS 2018 - Hong Kong, Hong Kong
    Duration: 14 Mar 201816 Mar 2018

    Publication series

    NameLecture Notes in Engineering and Computer Science
    Volume2
    ISSN (Print)2078-0958

    Conference

    Conference2018 International MultiConference of Engineers and Computer Scientists, IMECS 2018
    Country/TerritoryHong Kong
    CityHong Kong
    Period14/03/1816/03/18

    ASJC Scopus subject areas

    • Computer Science (miscellaneous)

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