Analysis of thermal mixing in T-junctions using fluid-structure interaction

Andrew R. Gow, Salim M. Salim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

23 Downloads (Pure)

Abstract

T-junctions are present in a wide range of industry and facilitate the mixing of fluids that are often at different temperatures. Temperature fluctuations introduced during the mixing process can result in thermal fatigue and consequently structural failure in the pipework. Predicting the magnitudes and locations of the stresses allows one to prevent and/or mitigate potential issues. A number of studies have investigated the fluid dynamics of T-junctions but very few have researched the impacts of the resulting flow field on the enveloping pipe materials especially where temperature fluctuations are significant. The present study employs steady-state one-way fluid-structure interaction analysis to determine the stress response of the pipework in a thermal-mixing T-junction situation. Firstly, the numerical flow field is simulated using CFD and validated against experimental data. Then, the effects of the fluid force fields on the pipe walls are modelled using structural analysis to predict the resulting stresses.

Original languageEnglish
Title of host publicationProceedings of the International MultiConference of Engineers and Computer Scientists 2018, IMECS 2018
EditorsOscar Castillo, David Dagan Feng, A.M. Korsunsky, Craig Douglas, S. I. Ao
PublisherNewswood Limited
ISBN (Electronic)9789881404886
Publication statusPublished - 14 Mar 2018
Event2018 International MultiConference of Engineers and Computer Scientists, IMECS 2018 - Hong Kong, Hong Kong
Duration: 14 Mar 201816 Mar 2018

Publication series

NameLecture Notes in Engineering and Computer Science
Volume2
ISSN (Print)2078-0958

Conference

Conference2018 International MultiConference of Engineers and Computer Scientists, IMECS 2018
CountryHong Kong
CityHong Kong
Period14/03/1816/03/18

    Fingerprint

Cite this

Gow, A. R., & Salim, S. M. (2018). Analysis of thermal mixing in T-junctions using fluid-structure interaction. In O. Castillo, D. D. Feng, A. M. Korsunsky, C. Douglas, & S. I. Ao (Eds.), Proceedings of the International MultiConference of Engineers and Computer Scientists 2018, IMECS 2018 (Lecture Notes in Engineering and Computer Science; Vol. 2). Newswood Limited.