Characterisation of an epoxy filler for piezocomposite material compatible with microfabrication processes

A. L. Bernassau; D. Hutson; C. E. M. Demore; S. Cochran

doi:10.1109/ULTSYM.2008.0016

Characterisation of an epoxy filler for piezocomposite material compatible with microfabrication processes

A. L. Bernassau, D. Hutson, C. E. M. Demore, S. Cochran

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

7 Citations (Scopus)

Abstract

High frequency ultrasound transducer arrays that can operate at frequencies above 30 MHz are needed for high resolution medical imaging. A key issue in the development of these miniature imaging arrays is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires not only planar, parallel and smooth surfaces, but also an epoxy composite filler that is resistant to chemicals, heat and vacuum. This paper reports the full characterisation of an epoxy filler suitable for fine-scale piezocomposite fabrication as well as photolithographic processes.

Original language	English
Title of host publication	2008 IEEE Ultrasonics Symposium
Subtitle of host publication	proceedings
Editors	Kendall R. Waters
Place of Publication	New York
Publisher	IEEE Computer Society
Pages	62-65
Number of pages	4
ISBN (Electronic)	9781424424801
ISBN (Print)	9781424424283
DOIs	https://doi.org/10.1109/ULTSYM.2008.0016
Publication status	Published - 2008
Event	2008 IEEE International Ultrasonics Symposium (IUS) - Beijing, China Duration: 2 Nov 2008 → 5 Nov 2008 http://ewh.ieee.org/conf/ius_2008/

Conference

Conference	2008 IEEE International Ultrasonics Symposium (IUS)
Abbreviated title	2008 IEEE IUS
Country/Territory	China
City	Beijing
Period	2/11/08 → 5/11/08
Internet address	http://ewh.ieee.org/conf/ius_2008/

Keywords

Epoxy adhesive
Cure temperature
Material properties
Acoustic properties
High frequency array
Photolithography
Ultrasound
Composite transducers

Access to Document

10.1109/ULTSYM.2008.0016

Cite this

@inproceedings{559c4a6b26ac48f0844d052a83b84e69,

title = "Characterisation of an epoxy filler for piezocomposite material compatible with microfabrication processes",

abstract = "High frequency ultrasound transducer arrays that can operate at frequencies above 30 MHz are needed for high resolution medical imaging. A key issue in the development of these miniature imaging arrays is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires not only planar, parallel and smooth surfaces, but also an epoxy composite filler that is resistant to chemicals, heat and vacuum. This paper reports the full characterisation of an epoxy filler suitable for fine-scale piezocomposite fabrication as well as photolithographic processes.",

keywords = "Epoxy adhesive, Cure temperature, Material properties, Acoustic properties, High frequency array, Photolithography, Ultrasound, Composite transducers",

author = "Bernassau, {A. L.} and D. Hutson and Demore, {C. E. M.} and S. Cochran",

year = "2008",

doi = "10.1109/ULTSYM.2008.0016",

language = "English",

isbn = "9781424424283",

pages = "62--65",

editor = "Waters, {Kendall R.}",

booktitle = "2008 IEEE Ultrasonics Symposium",

publisher = "IEEE Computer Society",

note = "2008 IEEE International Ultrasonics Symposium (IUS), 2008 IEEE IUS ; Conference date: 02-11-2008 Through 05-11-2008",

url = "http://ewh.ieee.org/conf/ius_2008/",

}

Bernassau, AL, Hutson, D, Demore, CEM & Cochran, S 2008, Characterisation of an epoxy filler for piezocomposite material compatible with microfabrication processes. in KR Waters (ed.), 2008 IEEE Ultrasonics Symposium: proceedings. IEEE Computer Society, New York, pp. 62-65, 2008 IEEE International Ultrasonics Symposium (IUS), Beijing, China, 2/11/08. https://doi.org/10.1109/ULTSYM.2008.0016

Characterisation of an epoxy filler for piezocomposite material compatible with microfabrication processes. / Bernassau, A. L.; Hutson, D.; Demore, C. E. M. et al.
2008 IEEE Ultrasonics Symposium: proceedings. ed. / Kendall R. Waters. New York: IEEE Computer Society, 2008. p. 62-65.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Characterisation of an epoxy filler for piezocomposite material compatible with microfabrication processes

AU - Bernassau, A. L.

AU - Hutson, D.

AU - Demore, C. E. M.

AU - Cochran, S.

PY - 2008

Y1 - 2008

N2 - High frequency ultrasound transducer arrays that can operate at frequencies above 30 MHz are needed for high resolution medical imaging. A key issue in the development of these miniature imaging arrays is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires not only planar, parallel and smooth surfaces, but also an epoxy composite filler that is resistant to chemicals, heat and vacuum. This paper reports the full characterisation of an epoxy filler suitable for fine-scale piezocomposite fabrication as well as photolithographic processes.

AB - High frequency ultrasound transducer arrays that can operate at frequencies above 30 MHz are needed for high resolution medical imaging. A key issue in the development of these miniature imaging arrays is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires not only planar, parallel and smooth surfaces, but also an epoxy composite filler that is resistant to chemicals, heat and vacuum. This paper reports the full characterisation of an epoxy filler suitable for fine-scale piezocomposite fabrication as well as photolithographic processes.

KW - Epoxy adhesive

KW - Cure temperature

KW - Material properties

KW - Acoustic properties

KW - High frequency array

KW - Photolithography

KW - Ultrasound

KW - Composite transducers

U2 - 10.1109/ULTSYM.2008.0016

DO - 10.1109/ULTSYM.2008.0016

M3 - Conference contribution

SN - 9781424424283

SP - 62

EP - 65

BT - 2008 IEEE Ultrasonics Symposium

A2 - Waters, Kendall R.

PB - IEEE Computer Society

CY - New York

T2 - 2008 IEEE International Ultrasonics Symposium (IUS)

Y2 - 2 November 2008 through 5 November 2008

ER -

Characterisation of an epoxy filler for piezocomposite material compatible with microfabrication processes

Abstract

Conference

Keywords

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