Characterisation of an epoxy filler for piezocomposite material compatible with microfabrication processes

A. L. Bernassau, D. Hutson, C. E. M. Demore, S. Cochran

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    7 Citations (Scopus)

    Abstract

    High frequency ultrasound transducer arrays that can operate at frequencies above 30 MHz are needed for high resolution medical imaging. A key issue in the development of these miniature imaging arrays is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires not only planar, parallel and smooth surfaces, but also an epoxy composite filler that is resistant to chemicals, heat and vacuum. This paper reports the full characterisation of an epoxy filler suitable for fine-scale piezocomposite fabrication as well as photolithographic processes.

    Original languageEnglish
    Title of host publication2008 IEEE Ultrasonics Symposium
    Subtitle of host publicationproceedings
    EditorsKendall R. Waters
    Place of PublicationNew York
    PublisherIEEE Computer Society
    Pages62-65
    Number of pages4
    ISBN (Electronic)9781424424801
    ISBN (Print)9781424424283
    DOIs
    Publication statusPublished - 2008
    Event2008 IEEE International Ultrasonics Symposium (IUS) - Beijing, China
    Duration: 2 Nov 20085 Nov 2008
    http://ewh.ieee.org/conf/ius_2008/

    Conference

    Conference2008 IEEE International Ultrasonics Symposium (IUS)
    Abbreviated title2008 IEEE IUS
    CountryChina
    CityBeijing
    Period2/11/085/11/08
    Internet address

    Keywords

    • Epoxy adhesive
    • Cure temperature
    • Material properties
    • Acoustic properties
    • High frequency array
    • Photolithography
    • Ultrasound
    • Composite transducers

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