Compact spectrometer chips based on fs laser written multi-layer scattering medium

Qi Sun; Tom Vettenburg; Timothy Lee; David Phillips; Martynas Beresna; Gilberto Brambilla

Compact spectrometer chips based on fs laser written multi-layer scattering medium

Qi Sun, Tom Vettenburg, Timothy Lee, David Phillips, Martynas Beresna, Gilberto Brambilla

Physics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A compact spectrometer with 0.2 nm resolution is demonstrated with a scattering chip in silica substrate. The chip is fabricated using femtosecond laser writing allowing to achieve high scattering efficiency within 100 micron thick layer.

Original language	English
Title of host publication	2019 Asia Communications and Photonics Conference (ACP)
Subtitle of host publication	Proceedings
Publisher	IEEE
Number of pages	3
ISBN (Electronic)	9781943580705
ISBN (Print)	9781728167688
Publication status	Published - 10 Nov 2019
Event	2019 Asia Communications and Photonics Conference, ACP 2019 - Chengdu, China Duration: 2 Nov 2019 → 5 Nov 2019

Publication series

Name	Optics InfoBase Conference Papers
Volume	Part F138-ACPC 2019

Conference

Conference	2019 Asia Communications and Photonics Conference, ACP 2019
Country/Territory	China
City	Chengdu
Period	2/11/19 → 5/11/19

ASJC Scopus subject areas

Computer Networks and Communications
Electrical and Electronic Engineering

Cite this

@inproceedings{8ca38a5d32534c37917bc9cff1c337fc,

title = "Compact spectrometer chips based on fs laser written multi-layer scattering medium",

abstract = "A compact spectrometer with 0.2 nm resolution is demonstrated with a scattering chip in silica substrate. The chip is fabricated using femtosecond laser writing allowing to achieve high scattering efficiency within 100 micron thick layer.",

author = "Qi Sun and Tom Vettenburg and Timothy Lee and David Phillips and Martynas Beresna and Gilberto Brambilla",

note = "Publisher Copyright: Asia Communications and Photonics Conference (ACP) {\textcopyright} OSA 2019 {\textcopyright} 2019 The Author(s) Copyright: Copyright 2020 Elsevier B.V., All rights reserved.; 2019 Asia Communications and Photonics Conference, ACP 2019 ; Conference date: 02-11-2019 Through 05-11-2019",

year = "2019",

month = nov,

day = "10",

language = "English",

isbn = "9781728167688",

series = "Optics InfoBase Conference Papers",

publisher = "IEEE",

booktitle = "2019 Asia Communications and Photonics Conference (ACP)",

}

Sun, Q, Vettenburg, T, Lee, T, Phillips, D, Beresna, M & Brambilla, G 2019, Compact spectrometer chips based on fs laser written multi-layer scattering medium. in 2019 Asia Communications and Photonics Conference (ACP): Proceedings., T4D.5, Optics InfoBase Conference Papers, vol. Part F138-ACPC 2019, IEEE, 2019 Asia Communications and Photonics Conference, ACP 2019, Chengdu, China, 2/11/19.

Compact spectrometer chips based on fs laser written multi-layer scattering medium. / Sun, Qi; Vettenburg, Tom; Lee, Timothy et al.
2019 Asia Communications and Photonics Conference (ACP): Proceedings. IEEE, 2019. T4D.5 (Optics InfoBase Conference Papers; Vol. Part F138-ACPC 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Compact spectrometer chips based on fs laser written multi-layer scattering medium

AU - Sun, Qi

AU - Vettenburg, Tom

AU - Lee, Timothy

AU - Phillips, David

AU - Beresna, Martynas

AU - Brambilla, Gilberto

PY - 2019/11/10

Y1 - 2019/11/10

N2 - A compact spectrometer with 0.2 nm resolution is demonstrated with a scattering chip in silica substrate. The chip is fabricated using femtosecond laser writing allowing to achieve high scattering efficiency within 100 micron thick layer.

AB - A compact spectrometer with 0.2 nm resolution is demonstrated with a scattering chip in silica substrate. The chip is fabricated using femtosecond laser writing allowing to achieve high scattering efficiency within 100 micron thick layer.

UR - https://ieeexplore.ieee.org/document/8989588

UR - http://www.scopus.com/inward/record.url?scp=85079797824&partnerID=8YFLogxK

M3 - Conference contribution

SN - 9781728167688

T3 - Optics InfoBase Conference Papers

BT - 2019 Asia Communications and Photonics Conference (ACP)

PB - IEEE

T2 - 2019 Asia Communications and Photonics Conference, ACP 2019

Y2 - 2 November 2019 through 5 November 2019

ER -

Compact spectrometer chips based on fs laser written multi-layer scattering medium

Abstract

Publication series

Conference

ASJC Scopus subject areas

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