Compact spectrometer chips based on fs laser written multi-layer scattering medium

Qi Sun, Tom Vettenburg, Timothy Lee, David Phillips, Martynas Beresna, Gilberto Brambilla

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A compact spectrometer with 0.2 nm resolution is demonstrated with a scattering chip in silica substrate. The chip is fabricated using femtosecond laser writing allowing to achieve high scattering efficiency within 100 micron thick layer.

Original languageEnglish
Title of host publication2019 Asia Communications and Photonics Conference (ACP)
Subtitle of host publicationProceedings
PublisherIEEE
Number of pages3
ISBN (Electronic)9781943580705
ISBN (Print)9781728167688
Publication statusPublished - 10 Nov 2019
Event2019 Asia Communications and Photonics Conference, ACP 2019 - Chengdu, China
Duration: 2 Nov 20195 Nov 2019

Conference

Conference2019 Asia Communications and Photonics Conference, ACP 2019
CountryChina
CityChengdu
Period2/11/195/11/19

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