Comparison of wax and wax-free mounting of irregular piezocomposite materials for thinning for high-frequency medical devices

A. L. Bernassau, J. J. McAneny, T. McGroggan, T. W. Button, H. Hughes, C. Meggs, S. Cochran

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    Ultrasound is used in more than 20% of biomedical imaging scans. Several clinical applications would benefit significantly from the higher spatial resolution offered by higher frequency operation than is presently common. A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on the surface of the piezoceramic-polymer composite material requires planar, parallel and smooth surfaces. An investigation of the surface finishing of piezocomposite material by mechanical lapping and/polishing has recently demonstrated that excellent surface flatness can be obtained. However, the use of wax mounting during the surface processing causes problems because of the required temperatures and the need to remove wax from the very fragile substrates after finishing. Conventional tape mounting cannot withstand the high lateral forces generated by the irregularly shaped samples presently produced by the composite development process. Wax-free mounting has been developed as an alternative, utilising a porous ceramic vacuum chuck incorporated within otherwise standard mechanical lapping/polishing equipment. High frequency array elements have been successfully fabricated on composite surfaces and good electrode edge definition and electrical contact to the composite have been obtained. It is expected that the use of the wax-free equipment and techniques will reduce the eventual cost and

    Original languageEnglish
    Title of host publication2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference
    Place of PublicationNEW YORK
    PublisherIEEE Computer Society
    Pages100-104
    Number of pages5
    ISBN (Electronic)9781424419654
    ISBN (Print)9781424419647
    Publication statusPublished - 2008
    Event2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) - Cambridge, United States
    Duration: 5 May 20087 May 2008
    http://www.ieee.org/conferences_events/conferences/conferencedetails/index.html?Conf_ID=13758

    Conference

    Conference2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
    Abbreviated titleASMC 2008
    CountryUnited States
    CityCambridge
    Period5/05/087/05/08
    Internet address

    Keywords

    • Substrate thinning
    • Composite materials
    • Piezoelectric ceramics
    • Wax mounting
    • Fabrication

    Cite this

    Bernassau, A. L., McAneny, J. J., McGroggan, T., Button, T. W., Hughes, H., Meggs, C., & Cochran, S. (2008). Comparison of wax and wax-free mounting of irregular piezocomposite materials for thinning for high-frequency medical devices. In 2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (pp. 100-104). NEW YORK: IEEE Computer Society.
    Bernassau, A. L. ; McAneny, J. J. ; McGroggan, T. ; Button, T. W. ; Hughes, H. ; Meggs, C. ; Cochran, S. / Comparison of wax and wax-free mounting of irregular piezocomposite materials for thinning for high-frequency medical devices. 2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference. NEW YORK : IEEE Computer Society, 2008. pp. 100-104
    @inproceedings{c1c2f4182a5b447085f084955fb85c3b,
    title = "Comparison of wax and wax-free mounting of irregular piezocomposite materials for thinning for high-frequency medical devices",
    abstract = "Ultrasound is used in more than 20{\%} of biomedical imaging scans. Several clinical applications would benefit significantly from the higher spatial resolution offered by higher frequency operation than is presently common. A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on the surface of the piezoceramic-polymer composite material requires planar, parallel and smooth surfaces. An investigation of the surface finishing of piezocomposite material by mechanical lapping and/polishing has recently demonstrated that excellent surface flatness can be obtained. However, the use of wax mounting during the surface processing causes problems because of the required temperatures and the need to remove wax from the very fragile substrates after finishing. Conventional tape mounting cannot withstand the high lateral forces generated by the irregularly shaped samples presently produced by the composite development process. Wax-free mounting has been developed as an alternative, utilising a porous ceramic vacuum chuck incorporated within otherwise standard mechanical lapping/polishing equipment. High frequency array elements have been successfully fabricated on composite surfaces and good electrode edge definition and electrical contact to the composite have been obtained. It is expected that the use of the wax-free equipment and techniques will reduce the eventual cost and",
    keywords = "Substrate thinning, Composite materials, Piezoelectric ceramics, Wax mounting, Fabrication",
    author = "Bernassau, {A. L.} and McAneny, {J. J.} and T. McGroggan and Button, {T. W.} and H. Hughes and C. Meggs and S. Cochran",
    year = "2008",
    language = "English",
    isbn = "9781424419647",
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    Bernassau, AL, McAneny, JJ, McGroggan, T, Button, TW, Hughes, H, Meggs, C & Cochran, S 2008, Comparison of wax and wax-free mounting of irregular piezocomposite materials for thinning for high-frequency medical devices. in 2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference. IEEE Computer Society, NEW YORK, pp. 100-104, 2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC), Cambridge, United States, 5/05/08.

    Comparison of wax and wax-free mounting of irregular piezocomposite materials for thinning for high-frequency medical devices. / Bernassau, A. L.; McAneny, J. J.; McGroggan, T.; Button, T. W.; Hughes, H.; Meggs, C.; Cochran, S.

    2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference. NEW YORK : IEEE Computer Society, 2008. p. 100-104.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    TY - GEN

    T1 - Comparison of wax and wax-free mounting of irregular piezocomposite materials for thinning for high-frequency medical devices

    AU - Bernassau, A. L.

    AU - McAneny, J. J.

    AU - McGroggan, T.

    AU - Button, T. W.

    AU - Hughes, H.

    AU - Meggs, C.

    AU - Cochran, S.

    PY - 2008

    Y1 - 2008

    N2 - Ultrasound is used in more than 20% of biomedical imaging scans. Several clinical applications would benefit significantly from the higher spatial resolution offered by higher frequency operation than is presently common. A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on the surface of the piezoceramic-polymer composite material requires planar, parallel and smooth surfaces. An investigation of the surface finishing of piezocomposite material by mechanical lapping and/polishing has recently demonstrated that excellent surface flatness can be obtained. However, the use of wax mounting during the surface processing causes problems because of the required temperatures and the need to remove wax from the very fragile substrates after finishing. Conventional tape mounting cannot withstand the high lateral forces generated by the irregularly shaped samples presently produced by the composite development process. Wax-free mounting has been developed as an alternative, utilising a porous ceramic vacuum chuck incorporated within otherwise standard mechanical lapping/polishing equipment. High frequency array elements have been successfully fabricated on composite surfaces and good electrode edge definition and electrical contact to the composite have been obtained. It is expected that the use of the wax-free equipment and techniques will reduce the eventual cost and

    AB - Ultrasound is used in more than 20% of biomedical imaging scans. Several clinical applications would benefit significantly from the higher spatial resolution offered by higher frequency operation than is presently common. A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on the surface of the piezoceramic-polymer composite material requires planar, parallel and smooth surfaces. An investigation of the surface finishing of piezocomposite material by mechanical lapping and/polishing has recently demonstrated that excellent surface flatness can be obtained. However, the use of wax mounting during the surface processing causes problems because of the required temperatures and the need to remove wax from the very fragile substrates after finishing. Conventional tape mounting cannot withstand the high lateral forces generated by the irregularly shaped samples presently produced by the composite development process. Wax-free mounting has been developed as an alternative, utilising a porous ceramic vacuum chuck incorporated within otherwise standard mechanical lapping/polishing equipment. High frequency array elements have been successfully fabricated on composite surfaces and good electrode edge definition and electrical contact to the composite have been obtained. It is expected that the use of the wax-free equipment and techniques will reduce the eventual cost and

    KW - Substrate thinning

    KW - Composite materials

    KW - Piezoelectric ceramics

    KW - Wax mounting

    KW - Fabrication

    M3 - Conference contribution

    SN - 9781424419647

    SP - 100

    EP - 104

    BT - 2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference

    PB - IEEE Computer Society

    CY - NEW YORK

    ER -

    Bernassau AL, McAneny JJ, McGroggan T, Button TW, Hughes H, Meggs C et al. Comparison of wax and wax-free mounting of irregular piezocomposite materials for thinning for high-frequency medical devices. In 2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference. NEW YORK: IEEE Computer Society. 2008. p. 100-104