Design, manufacturing and packaging of high frequency micro ultrasonic transducers for medical applications

J. H.-G. Ng; R. T. Ssekitoleko; D. Flynn; R. W. Kay; C. E. M. Demore; S. Cochran; M. P. Y. Desmulliez

doi:10.1109/EPTC.2011.6184393

Design, manufacturing and packaging of high frequency micro ultrasonic transducers for medical applications

J. H.-G. Ng, R. T. Ssekitoleko, D. Flynn, R. W. Kay, C. E. M. Demore, S. Cochran, M. P. Y. Desmulliez

Research output: Chapter in Book/Report/Conference proceeding › Other chapter contribution

3 Citations (Scopus)

Abstract

The challenges for the realization of a miniaturized high frequency ultrasonic transducer linear array lie in the interconnections on the fine pitch piezoceramic elements. Within the footprint the size of a needle, only peripheral interconnections can be allowed on the transducer array such that the acoustic operations on both faces of the vibrating piezoelectric elements are not obstructed. The very low maximum processing temperature allowed also poses difficulty for conventional bonding techniques. This article presents 3-dimensional packaging using spirally rolled flexible circuits, room-temperature anisotropic conductive bonding and stencil printing for the setup of a wafer-level production process flow. © 2011 IEEE.

Original language	English
Title of host publication	EPTC 2011
Subtitle of host publication	IEEE 13th Electronics Packaging Technology Conference
Publisher	IEEE Computer Society
Pages	93-98
Number of pages	6
ISBN (Electronic)	978-1-4577-1981-3
ISBN (Print)	978-1-4577-1983-7
DOIs	https://doi.org/10.1109/EPTC.2011.6184393
Publication status	Published - 2011
Event	13th IEEE Electronics Packaging Technology Conference - , Singapore Duration: 7 Dec 2011 → 9 Dec 2011 http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=6178148

Conference

Conference	13th IEEE Electronics Packaging Technology Conference
Country/Territory	Singapore
Period	7/12/11 → 9/12/11
Internet address	http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=6178148

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10.1109/EPTC.2011.6184393

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Ng, J. H.-G., Ssekitoleko, R. T., Flynn, D., Kay, R. W., Demore, C. E. M., Cochran, S., & Desmulliez, M. P. Y. (2011). Design, manufacturing and packaging of high frequency micro ultrasonic transducers for medical applications. In EPTC 2011: IEEE 13th Electronics Packaging Technology Conference (pp. 93-98). IEEE Computer Society. https://doi.org/10.1109/EPTC.2011.6184393

@inbook{a3112507baff4f3e910730159ff2858f,

title = "Design, manufacturing and packaging of high frequency micro ultrasonic transducers for medical applications",

abstract = "The challenges for the realization of a miniaturized high frequency ultrasonic transducer linear array lie in the interconnections on the fine pitch piezoceramic elements. Within the footprint the size of a needle, only peripheral interconnections can be allowed on the transducer array such that the acoustic operations on both faces of the vibrating piezoelectric elements are not obstructed. The very low maximum processing temperature allowed also poses difficulty for conventional bonding techniques. This article presents 3-dimensional packaging using spirally rolled flexible circuits, room-temperature anisotropic conductive bonding and stencil printing for the setup of a wafer-level production process flow. {\textcopyright} 2011 IEEE.",

author = "Ng, {J. H.-G.} and Ssekitoleko, {R. T.} and D. Flynn and Kay, {R. W.} and Demore, {C. E. M.} and S. Cochran and Desmulliez, {M. P. Y.}",

year = "2011",

doi = "10.1109/EPTC.2011.6184393",

language = "English",

isbn = "978-1-4577-1983-7",

pages = "93--98",

booktitle = "EPTC 2011",

publisher = "IEEE Computer Society",

note = "13th IEEE Electronics Packaging Technology Conference ; Conference date: 07-12-2011 Through 09-12-2011",

url = "http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=6178148",

}

Ng, JH-G, Ssekitoleko, RT, Flynn, D, Kay, RW, Demore, CEM, Cochran, S & Desmulliez, MPY 2011, Design, manufacturing and packaging of high frequency micro ultrasonic transducers for medical applications. in EPTC 2011: IEEE 13th Electronics Packaging Technology Conference . IEEE Computer Society, pp. 93-98, 13th IEEE Electronics Packaging Technology Conference, Singapore, 7/12/11. https://doi.org/10.1109/EPTC.2011.6184393

TY - CHAP

T1 - Design, manufacturing and packaging of high frequency micro ultrasonic transducers for medical applications

AU - Ng, J. H.-G.

AU - Ssekitoleko, R. T.

AU - Flynn, D.

AU - Kay, R. W.

AU - Demore, C. E. M.

AU - Cochran, S.

AU - Desmulliez, M. P. Y.

PY - 2011

Y1 - 2011

N2 - The challenges for the realization of a miniaturized high frequency ultrasonic transducer linear array lie in the interconnections on the fine pitch piezoceramic elements. Within the footprint the size of a needle, only peripheral interconnections can be allowed on the transducer array such that the acoustic operations on both faces of the vibrating piezoelectric elements are not obstructed. The very low maximum processing temperature allowed also poses difficulty for conventional bonding techniques. This article presents 3-dimensional packaging using spirally rolled flexible circuits, room-temperature anisotropic conductive bonding and stencil printing for the setup of a wafer-level production process flow. © 2011 IEEE.

AB - The challenges for the realization of a miniaturized high frequency ultrasonic transducer linear array lie in the interconnections on the fine pitch piezoceramic elements. Within the footprint the size of a needle, only peripheral interconnections can be allowed on the transducer array such that the acoustic operations on both faces of the vibrating piezoelectric elements are not obstructed. The very low maximum processing temperature allowed also poses difficulty for conventional bonding techniques. This article presents 3-dimensional packaging using spirally rolled flexible circuits, room-temperature anisotropic conductive bonding and stencil printing for the setup of a wafer-level production process flow. © 2011 IEEE.

U2 - 10.1109/EPTC.2011.6184393

DO - 10.1109/EPTC.2011.6184393

M3 - Other chapter contribution

SN - 978-1-4577-1983-7

SP - 93

EP - 98

BT - EPTC 2011

PB - IEEE Computer Society

T2 - 13th IEEE Electronics Packaging Technology Conference

Y2 - 7 December 2011 through 9 December 2011

ER -

Design, manufacturing and packaging of high frequency micro ultrasonic transducers for medical applications

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