Design, manufacturing and packaging of high frequency micro ultrasonic transducers for medical applications

J. H.-G. Ng, R. T. Ssekitoleko, D. Flynn, R. W. Kay, C. E. M. Demore, S. Cochran, M. P. Y. Desmulliez

    Research output: Chapter in Book/Report/Conference proceedingOther chapter contribution

    2 Citations (Scopus)

    Abstract

    The challenges for the realization of a miniaturized high frequency ultrasonic transducer linear array lie in the interconnections on the fine pitch piezoceramic elements. Within the footprint the size of a needle, only peripheral interconnections can be allowed on the transducer array such that the acoustic operations on both faces of the vibrating piezoelectric elements are not obstructed. The very low maximum processing temperature allowed also poses difficulty for conventional bonding techniques. This article presents 3-dimensional packaging using spirally rolled flexible circuits, room-temperature anisotropic conductive bonding and stencil printing for the setup of a wafer-level production process flow. © 2011 IEEE.
    Original languageEnglish
    Title of host publicationEPTC 2011
    Subtitle of host publicationIEEE 13th Electronics Packaging Technology Conference
    PublisherIEEE Computer Society
    Pages93-98
    Number of pages6
    ISBN (Electronic)978-1-4577-1981-3
    ISBN (Print)978-1-4577-1983-7
    DOIs
    Publication statusPublished - 2011
    Event13th IEEE Electronics Packaging Technology Conference - , Singapore
    Duration: 7 Dec 20119 Dec 2011
    http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=6178148

    Conference

    Conference13th IEEE Electronics Packaging Technology Conference
    CountrySingapore
    Period7/12/119/12/11
    Internet address

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