Direct metallisation of polyetherimide substrates by activation with different metals

Thomas Jones (Lead / Corresponding author), Assel Ryspayeva, Mohammadreza N. Esfahani, Matthew P. Shuttleworth, Russell A. Harris, Robert W. Kay, Marc P. Y. Desmulliez, Jose Marques-Hueso

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

This article reports the performance of different metallic ions and nanoparticles (Ag, Cu, Ni, Pd, Cr, Co, Au and Fe) used as seed layers, formed by chemical or optical reduction, for the electroless Cu plating of metal tracks onto polyetherimide (PEI). Plated Cu performance was tested by adhesion, electrical conductivity, plating rate, XPS, SEM, XRD and EDX analysis. The application of Cu and Ag seeds resulted in high quality electroless Cu deposits presenting strong adhesion properties and high conductivity ((2.0±0.5)×10⁠7 S/m and (3.6±0.2)×10⁠7 S/m, respectively) compared with bulk copper (5.96×10⁠7 S/m). Performance is attributed to the high surface density and uniformity of seed layers. Of the metals, only Ag ions were photoreduced under the conditions applied and were subsequently used to electroless Cu plate high quality track features of 150μm width. The application of sulphuric acid pre-treatment to PEI prior to Ag ion exchange, improved the photoinitiated track formation process, as demonstrated by a threefold increase to both photoinduced Ag nanoparticle density on the surface and electroless Cu plating rate, as well as improved electroless Cu adhesion to PEI.
Original languageEnglish
Pages (from-to)285-296
Number of pages12
JournalSurface & Coatings Technology
Volume360
Early online date9 Jan 2019
DOIs
Publication statusPublished - 25 Feb 2019

Fingerprint

Polyetherimides
Metallizing
plating
Plating
Seed
seeds
adhesion
Adhesion
Metals
Chemical activation
activation
Substrates
metals
Ions
Nanoparticles
nanoparticles
ions
pretreatment
Copper
Energy dispersive spectroscopy

Keywords

  • Direct metallisation
  • Photoreduction
  • Polyetherimide
  • Electroless copper
  • Metal catalyst
  • Electrical interconnect

Cite this

Jones, T., Ryspayeva, A., Esfahani, M. N., Shuttleworth, M. P., Harris, R. A., Kay, R. W., ... Marques-Hueso, J. (2019). Direct metallisation of polyetherimide substrates by activation with different metals. Surface & Coatings Technology, 360, 285-296. https://doi.org/10.1016/j.surfcoat.2019.01.023
Jones, Thomas ; Ryspayeva, Assel ; Esfahani, Mohammadreza N. ; Shuttleworth, Matthew P. ; Harris, Russell A. ; Kay, Robert W. ; Desmulliez, Marc P. Y. ; Marques-Hueso, Jose. / Direct metallisation of polyetherimide substrates by activation with different metals. In: Surface & Coatings Technology. 2019 ; Vol. 360. pp. 285-296.
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Jones, T, Ryspayeva, A, Esfahani, MN, Shuttleworth, MP, Harris, RA, Kay, RW, Desmulliez, MPY & Marques-Hueso, J 2019, 'Direct metallisation of polyetherimide substrates by activation with different metals', Surface & Coatings Technology, vol. 360, pp. 285-296. https://doi.org/10.1016/j.surfcoat.2019.01.023

Direct metallisation of polyetherimide substrates by activation with different metals. / Jones, Thomas (Lead / Corresponding author); Ryspayeva, Assel; Esfahani, Mohammadreza N.; Shuttleworth, Matthew P.; Harris, Russell A.; Kay, Robert W.; Desmulliez, Marc P. Y.; Marques-Hueso, Jose.

In: Surface & Coatings Technology, Vol. 360, 25.02.2019, p. 285-296.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Direct metallisation of polyetherimide substrates by activation with different metals

AU - Jones, Thomas

AU - Ryspayeva, Assel

AU - Esfahani, Mohammadreza N.

AU - Shuttleworth, Matthew P.

AU - Harris, Russell A.

AU - Kay, Robert W.

AU - Desmulliez, Marc P. Y.

AU - Marques-Hueso, Jose

PY - 2019/2/25

Y1 - 2019/2/25

N2 - This article reports the performance of different metallic ions and nanoparticles (Ag, Cu, Ni, Pd, Cr, Co, Au and Fe) used as seed layers, formed by chemical or optical reduction, for the electroless Cu plating of metal tracks onto polyetherimide (PEI). Plated Cu performance was tested by adhesion, electrical conductivity, plating rate, XPS, SEM, XRD and EDX analysis. The application of Cu and Ag seeds resulted in high quality electroless Cu deposits presenting strong adhesion properties and high conductivity ((2.0±0.5)×10⁠7 S/m and (3.6±0.2)×10⁠7 S/m, respectively) compared with bulk copper (5.96×10⁠7 S/m). Performance is attributed to the high surface density and uniformity of seed layers. Of the metals, only Ag ions were photoreduced under the conditions applied and were subsequently used to electroless Cu plate high quality track features of 150μm width. The application of sulphuric acid pre-treatment to PEI prior to Ag ion exchange, improved the photoinitiated track formation process, as demonstrated by a threefold increase to both photoinduced Ag nanoparticle density on the surface and electroless Cu plating rate, as well as improved electroless Cu adhesion to PEI.

AB - This article reports the performance of different metallic ions and nanoparticles (Ag, Cu, Ni, Pd, Cr, Co, Au and Fe) used as seed layers, formed by chemical or optical reduction, for the electroless Cu plating of metal tracks onto polyetherimide (PEI). Plated Cu performance was tested by adhesion, electrical conductivity, plating rate, XPS, SEM, XRD and EDX analysis. The application of Cu and Ag seeds resulted in high quality electroless Cu deposits presenting strong adhesion properties and high conductivity ((2.0±0.5)×10⁠7 S/m and (3.6±0.2)×10⁠7 S/m, respectively) compared with bulk copper (5.96×10⁠7 S/m). Performance is attributed to the high surface density and uniformity of seed layers. Of the metals, only Ag ions were photoreduced under the conditions applied and were subsequently used to electroless Cu plate high quality track features of 150μm width. The application of sulphuric acid pre-treatment to PEI prior to Ag ion exchange, improved the photoinitiated track formation process, as demonstrated by a threefold increase to both photoinduced Ag nanoparticle density on the surface and electroless Cu plating rate, as well as improved electroless Cu adhesion to PEI.

KW - Direct metallisation

KW - Photoreduction

KW - Polyetherimide

KW - Electroless copper

KW - Metal catalyst

KW - Electrical interconnect

U2 - 10.1016/j.surfcoat.2019.01.023

DO - 10.1016/j.surfcoat.2019.01.023

M3 - Article

VL - 360

SP - 285

EP - 296

JO - Surface & Coatings Technology

JF - Surface & Coatings Technology

SN - 0257-8972

ER -