Effects of Ar and O₂ Plasma Etching on Parylene C: Topography versus Surface Chemistry and the Impact on Cell Viability

The effect of O₂ and Ar plasma etching on poly(chloro-p-xylylene) (Parylene C) is thoroughly studied by atomic force microscopy, X-ray photoelectron spectroscopy, and static contact angle measurements. Results indicate that O₂ plasma changes the topography more drastically than Ar plasma. Furthermore, despite the fact that Ar plasma is expected to be chemically inert, both plasmas introduce O₂ to the surface of the Parylene C films, while Ar plasma additionally reduces the amount of Cl present in the polymer. The effect on the viability of cultured cardiomyocytes is also examined, indicating that cells attach and survive both on Ar and O₂ treated films in contrast to untreated Parylene. These observations can provide useful insight into the field of material science and tissue engineering. The effects of O₂ and Ar plasma on the nanotopography and surface chemistry of Parylene C are studied. Atomic force microscopy and X-ray photoelectron spectroscopy indicate that O₂ plasma changes the topography more drastically than Ar plasma. Both plasmas introduce O₂ to Parylene, but Ar plasma reduces the amount of Cl. These observations are reflected on the viability of cultured cardiomyocytes.