Electroplating for high aspect ratio vias in PCB manufacturing:  Enhancement capabilities of acoustic streaming

Nadezhda Strusevich; Marc P Y Desmulliez; Eitan Abraham; David Flynn; Tom Jones; Mayur Patel; Christopher Bailey

doi:10.1007/s40436-013-0039-9

Electroplating for high aspect ratio vias in PCB manufacturing: Enhancement capabilities of acoustic streaming

Nadezhda Strusevich, Marc P Y Desmulliez, Eitan Abraham, David Flynn, Tom Jones, Mayur Patel, Christopher Bailey

Research output: Contribution to journal › Article › peer-review

12 Citations (Scopus)

Abstract

This paper considers the copper electrodeposition processes in microvias and investigates whether the quality of the electroplating process can be improved by acoustic streaming using megasonic transducers placed into a plating cell. The theoretical results show that acoustic streaming does not take place within the micro-via (either through or blind-via's), however it does help improve cupric ion transport in the area close to the mouth of a via. This replenishment of cupric ions at the mouth of micro-via leads to better quality filling of the micro-via through diffusion compared to basic conditions. Experiments showing the improved quality of the filling of vias are also presented.

Original language	English
Pages (from-to)	211-217
Number of pages	7
Journal	Advances in Manufacturing
Volume	1
Issue number	3
DOIs	https://doi.org/10.1007/s40436-013-0039-9
Publication status	Published - 1 Jan 2013

Keywords

Acoustic streaming, Electronics manufacturing, Electroplating, High aspect ratio microvia, Megasonic agitation, Numerical modelling

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10.1007/s40436-013-0039-9

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title = "Electroplating for high aspect ratio vias in PCB manufacturing: Enhancement capabilities of acoustic streaming",

abstract = "This paper considers the copper electrodeposition processes in microvias and investigates whether the quality of the electroplating process can be improved by acoustic streaming using megasonic transducers placed into a plating cell. The theoretical results show that acoustic streaming does not take place within the micro-via (either through or blind-via's), however it does help improve cupric ion transport in the area close to the mouth of a via. This replenishment of cupric ions at the mouth of micro-via leads to better quality filling of the micro-via through diffusion compared to basic conditions. Experiments showing the improved quality of the filling of vias are also presented.",

keywords = "Acoustic streaming, Electronics manufacturing, Electroplating, High aspect ratio microvia, Megasonic agitation, Numerical modelling",

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AU - Strusevich, Nadezhda

AU - Desmulliez, Marc P Y

AU - Abraham, Eitan

AU - Flynn, David

AU - Jones, Tom

AU - Patel, Mayur

AU - Bailey, Christopher

PY - 2013/1/1

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N2 - This paper considers the copper electrodeposition processes in microvias and investigates whether the quality of the electroplating process can be improved by acoustic streaming using megasonic transducers placed into a plating cell. The theoretical results show that acoustic streaming does not take place within the micro-via (either through or blind-via's), however it does help improve cupric ion transport in the area close to the mouth of a via. This replenishment of cupric ions at the mouth of micro-via leads to better quality filling of the micro-via through diffusion compared to basic conditions. Experiments showing the improved quality of the filling of vias are also presented.

AB - This paper considers the copper electrodeposition processes in microvias and investigates whether the quality of the electroplating process can be improved by acoustic streaming using megasonic transducers placed into a plating cell. The theoretical results show that acoustic streaming does not take place within the micro-via (either through or blind-via's), however it does help improve cupric ion transport in the area close to the mouth of a via. This replenishment of cupric ions at the mouth of micro-via leads to better quality filling of the micro-via through diffusion compared to basic conditions. Experiments showing the improved quality of the filling of vias are also presented.

KW - Acoustic streaming, Electronics manufacturing, Electroplating, High aspect ratio microvia, Megasonic agitation, Numerical modelling

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EP - 217

JO - Advances in Manufacturing

JF - Advances in Manufacturing

IS - 3

ER -

Electroplating for high aspect ratio vias in PCB manufacturing: Enhancement capabilities of acoustic streaming

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