Future integration of silicon electronics with miniature piezoelectric ultrasonic transducers and arrays

Sandy Cochran, Anne Bernassau, David Cumming, Christine Démoré, Marc Desmulliez, John Sweet

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    5 Citations (Scopus)

    Abstract

    The long-established pace of progress in semiconductor electronics, expressed by Moore's Law, has led to new opportunities in medical ultrasound imaging. Traditionally, ultrasound systems have separated the transducer array from most of the electronic instrumentation, with multicore physical cabling in between. This avoids problems with electrical power, functional density, and communication bandwidth. However, it is far from ideal in terms of cost, ergonomics, and the need to interface instrumentation and the transducer with the cable, and it causes particular difficulties with miniature devices. Given these issues, and the relatively slow progress in front-end transducer technology, integration of the transducer with electronics is certain to increase, most likely at a pace governed by financial investment, development of electronics for other applications, and the realisation of high volume ultrasound applications. This paper therefore considers motivations for increased integration, technical barriers, and relevant new techniques, particularly related to microelectromechanical systems (MEMS). Increased integration will rely on advances in integrated circuit (IC) electronics, device assembly, and microsystems engineering, with key constraints being the packaging of a system in a small volume and the power supply. System partitioning will determine where functionality will reside physically within the imaging hardware and software. This paper considers relevant recent developments in academic research and industry, with a particular focus on medical applications. IC design is important because it defines parameters such as power consumption. 45 nm ICs are now in high volume production but the present relatively small ultrasound market makes adoption difficult. Ingenuity in exploiting existing technology cost-effectively and bespoke engineering where required are likely to be important for integration of piezoelectric material with electronics technology and functionality will correspond with different layers in a device. In this paper, examples are selected from the authors' work to illustrate progress and suggest how MEMS roadmaps and application demands may relate to future systems.
    Original languageEnglish
    Title of host publication2010 IEEE International Ultrasonics Symposium Proceedings
    PublisherIEEE
    Pages1108-1116
    Number of pages9
    ISBN (Electronic)978-1-4577-0381-2/10
    DOIs
    Publication statusPublished - 2009

    Fingerprint

    Ultrasonic transducers
    Piezoelectric transducers
    Electronic equipment
    Transducers
    Silicon
    Ultrasonics
    MEMS
    Imaging techniques
    Piezoelectric materials
    Microsystems
    Medical applications
    Ergonomics
    Integrated circuits
    Costs
    Packaging
    Cables
    Electric power utilization
    Semiconductor materials
    Hardware
    Bandwidth

    Cite this

    Cochran, S., Bernassau, A., Cumming, D., Démoré, C., Desmulliez, M., & Sweet, J. (2009). Future integration of silicon electronics with miniature piezoelectric ultrasonic transducers and arrays. In 2010 IEEE International Ultrasonics Symposium Proceedings (pp. 1108-1116). IEEE. https://doi.org/10.1109/ULTSYM.2010.5935950
    Cochran, Sandy ; Bernassau, Anne ; Cumming, David ; Démoré, Christine ; Desmulliez, Marc ; Sweet, John. / Future integration of silicon electronics with miniature piezoelectric ultrasonic transducers and arrays. 2010 IEEE International Ultrasonics Symposium Proceedings. IEEE, 2009. pp. 1108-1116
    @inproceedings{6afcb863097f4154aea62c01bb4b27c0,
    title = "Future integration of silicon electronics with miniature piezoelectric ultrasonic transducers and arrays",
    abstract = "The long-established pace of progress in semiconductor electronics, expressed by Moore's Law, has led to new opportunities in medical ultrasound imaging. Traditionally, ultrasound systems have separated the transducer array from most of the electronic instrumentation, with multicore physical cabling in between. This avoids problems with electrical power, functional density, and communication bandwidth. However, it is far from ideal in terms of cost, ergonomics, and the need to interface instrumentation and the transducer with the cable, and it causes particular difficulties with miniature devices. Given these issues, and the relatively slow progress in front-end transducer technology, integration of the transducer with electronics is certain to increase, most likely at a pace governed by financial investment, development of electronics for other applications, and the realisation of high volume ultrasound applications. This paper therefore considers motivations for increased integration, technical barriers, and relevant new techniques, particularly related to microelectromechanical systems (MEMS). Increased integration will rely on advances in integrated circuit (IC) electronics, device assembly, and microsystems engineering, with key constraints being the packaging of a system in a small volume and the power supply. System partitioning will determine where functionality will reside physically within the imaging hardware and software. This paper considers relevant recent developments in academic research and industry, with a particular focus on medical applications. IC design is important because it defines parameters such as power consumption. 45 nm ICs are now in high volume production but the present relatively small ultrasound market makes adoption difficult. Ingenuity in exploiting existing technology cost-effectively and bespoke engineering where required are likely to be important for integration of piezoelectric material with electronics technology and functionality will correspond with different layers in a device. In this paper, examples are selected from the authors' work to illustrate progress and suggest how MEMS roadmaps and application demands may relate to future systems.",
    author = "Sandy Cochran and Anne Bernassau and David Cumming and Christine D{\'e}mor{\'e} and Marc Desmulliez and John Sweet",
    year = "2009",
    doi = "10.1109/ULTSYM.2010.5935950",
    language = "English",
    pages = "1108--1116",
    booktitle = "2010 IEEE International Ultrasonics Symposium Proceedings",
    publisher = "IEEE",

    }

    Cochran, S, Bernassau, A, Cumming, D, Démoré, C, Desmulliez, M & Sweet, J 2009, Future integration of silicon electronics with miniature piezoelectric ultrasonic transducers and arrays. in 2010 IEEE International Ultrasonics Symposium Proceedings. IEEE, pp. 1108-1116. https://doi.org/10.1109/ULTSYM.2010.5935950

    Future integration of silicon electronics with miniature piezoelectric ultrasonic transducers and arrays. / Cochran, Sandy; Bernassau, Anne; Cumming, David; Démoré, Christine; Desmulliez, Marc; Sweet, John.

    2010 IEEE International Ultrasonics Symposium Proceedings. IEEE, 2009. p. 1108-1116.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    TY - GEN

    T1 - Future integration of silicon electronics with miniature piezoelectric ultrasonic transducers and arrays

    AU - Cochran, Sandy

    AU - Bernassau, Anne

    AU - Cumming, David

    AU - Démoré, Christine

    AU - Desmulliez, Marc

    AU - Sweet, John

    PY - 2009

    Y1 - 2009

    N2 - The long-established pace of progress in semiconductor electronics, expressed by Moore's Law, has led to new opportunities in medical ultrasound imaging. Traditionally, ultrasound systems have separated the transducer array from most of the electronic instrumentation, with multicore physical cabling in between. This avoids problems with electrical power, functional density, and communication bandwidth. However, it is far from ideal in terms of cost, ergonomics, and the need to interface instrumentation and the transducer with the cable, and it causes particular difficulties with miniature devices. Given these issues, and the relatively slow progress in front-end transducer technology, integration of the transducer with electronics is certain to increase, most likely at a pace governed by financial investment, development of electronics for other applications, and the realisation of high volume ultrasound applications. This paper therefore considers motivations for increased integration, technical barriers, and relevant new techniques, particularly related to microelectromechanical systems (MEMS). Increased integration will rely on advances in integrated circuit (IC) electronics, device assembly, and microsystems engineering, with key constraints being the packaging of a system in a small volume and the power supply. System partitioning will determine where functionality will reside physically within the imaging hardware and software. This paper considers relevant recent developments in academic research and industry, with a particular focus on medical applications. IC design is important because it defines parameters such as power consumption. 45 nm ICs are now in high volume production but the present relatively small ultrasound market makes adoption difficult. Ingenuity in exploiting existing technology cost-effectively and bespoke engineering where required are likely to be important for integration of piezoelectric material with electronics technology and functionality will correspond with different layers in a device. In this paper, examples are selected from the authors' work to illustrate progress and suggest how MEMS roadmaps and application demands may relate to future systems.

    AB - The long-established pace of progress in semiconductor electronics, expressed by Moore's Law, has led to new opportunities in medical ultrasound imaging. Traditionally, ultrasound systems have separated the transducer array from most of the electronic instrumentation, with multicore physical cabling in between. This avoids problems with electrical power, functional density, and communication bandwidth. However, it is far from ideal in terms of cost, ergonomics, and the need to interface instrumentation and the transducer with the cable, and it causes particular difficulties with miniature devices. Given these issues, and the relatively slow progress in front-end transducer technology, integration of the transducer with electronics is certain to increase, most likely at a pace governed by financial investment, development of electronics for other applications, and the realisation of high volume ultrasound applications. This paper therefore considers motivations for increased integration, technical barriers, and relevant new techniques, particularly related to microelectromechanical systems (MEMS). Increased integration will rely on advances in integrated circuit (IC) electronics, device assembly, and microsystems engineering, with key constraints being the packaging of a system in a small volume and the power supply. System partitioning will determine where functionality will reside physically within the imaging hardware and software. This paper considers relevant recent developments in academic research and industry, with a particular focus on medical applications. IC design is important because it defines parameters such as power consumption. 45 nm ICs are now in high volume production but the present relatively small ultrasound market makes adoption difficult. Ingenuity in exploiting existing technology cost-effectively and bespoke engineering where required are likely to be important for integration of piezoelectric material with electronics technology and functionality will correspond with different layers in a device. In this paper, examples are selected from the authors' work to illustrate progress and suggest how MEMS roadmaps and application demands may relate to future systems.

    UR - http://www.scopus.com/inward/record.url?scp=80054722137&partnerID=8YFLogxK

    U2 - 10.1109/ULTSYM.2010.5935950

    DO - 10.1109/ULTSYM.2010.5935950

    M3 - Conference contribution

    SP - 1108

    EP - 1116

    BT - 2010 IEEE International Ultrasonics Symposium Proceedings

    PB - IEEE

    ER -

    Cochran S, Bernassau A, Cumming D, Démoré C, Desmulliez M, Sweet J. Future integration of silicon electronics with miniature piezoelectric ultrasonic transducers and arrays. In 2010 IEEE International Ultrasonics Symposium Proceedings. IEEE. 2009. p. 1108-1116 https://doi.org/10.1109/ULTSYM.2010.5935950