Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications

J.H.G. Ng, D. Flynn, R.W. Kay, M.P.Y. Desmulliez, R.T. Ssekitoleko, C. Démoré, S. Cochran

    Research output: Chapter in Book/Report/Conference proceedingOther chapter contribution

    3 Citations (Scopus)

    Abstract

    This article presents the innovative manufacturing and 3-dimensional packaging of a miniaturized ultrasonic transducer for medical applications. A spirally rolled-up flexible circuit was employed for the interconnection of a linear transducer array to be used in a needle size footprint. Photolithography, precision dicing and low temperature conductive bonding are amongst the technologies under investigation for the realization of this high frequency ultrasound device.
    Original languageEnglish
    Title of host publicationEMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings
    Publication statusPublished - 1 Jan 2011

    Fingerprint Dive into the research topics of 'Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications'. Together they form a unique fingerprint.

  • Cite this

    Ng, J. H. G., Flynn, D., Kay, R. W., Desmulliez, M. P. Y., Ssekitoleko, R. T., Démoré, C., & Cochran, S. (2011). Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications. In EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings