Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications

J.H.G. Ng; D. Flynn; R.W. Kay; M.P.Y. Desmulliez; R.T. Ssekitoleko; C. Démoré; S. Cochran

Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications

J.H.G. Ng, D. Flynn, R.W. Kay, M.P.Y. Desmulliez, R.T. Ssekitoleko, C. Démoré, S. Cochran

Research output: Chapter in Book/Report/Conference proceeding › Other chapter contribution

Abstract

This article presents the innovative manufacturing and 3-dimensional packaging of a miniaturized ultrasonic transducer for medical applications. A spirally rolled-up flexible circuit was employed for the interconnection of a linear transducer array to be used in a needle size footprint. Photolithography, precision dicing and low temperature conductive bonding are amongst the technologies under investigation for the realization of this high frequency ultrasound device.

Original language	English
Title of host publication	EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings
Publication status	Published - 1 Jan 2011

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@inbook{1673c7673267435a8e9a89800a54913e,

title = "Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications",

abstract = "This article presents the innovative manufacturing and 3-dimensional packaging of a miniaturized ultrasonic transducer for medical applications. A spirally rolled-up flexible circuit was employed for the interconnection of a linear transducer array to be used in a needle size footprint. Photolithography, precision dicing and low temperature conductive bonding are amongst the technologies under investigation for the realization of this high frequency ultrasound device.",

author = "J.H.G. Ng and D. Flynn and R.W. Kay and M.P.Y. Desmulliez and R.T. Ssekitoleko and C. D{\'e}mor{\'e} and S. Cochran",

year = "2011",

month = jan,

day = "1",

language = "English",

booktitle = "EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings",

}

TY - CHAP

T1 - Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications

AU - Ng, J.H.G.

AU - Flynn, D.

AU - Kay, R.W.

AU - Desmulliez, M.P.Y.

AU - Ssekitoleko, R.T.

AU - Démoré, C.

AU - Cochran, S.

PY - 2011/1/1

Y1 - 2011/1/1

N2 - This article presents the innovative manufacturing and 3-dimensional packaging of a miniaturized ultrasonic transducer for medical applications. A spirally rolled-up flexible circuit was employed for the interconnection of a linear transducer array to be used in a needle size footprint. Photolithography, precision dicing and low temperature conductive bonding are amongst the technologies under investigation for the realization of this high frequency ultrasound device.

AB - This article presents the innovative manufacturing and 3-dimensional packaging of a miniaturized ultrasonic transducer for medical applications. A spirally rolled-up flexible circuit was employed for the interconnection of a linear transducer array to be used in a needle size footprint. Photolithography, precision dicing and low temperature conductive bonding are amongst the technologies under investigation for the realization of this high frequency ultrasound device.

UR - http://www.scopus.com/inward/record.url?scp=84857552861&partnerID=8YFLogxK

M3 - Other chapter contribution

AN - SCOPUS:84857552861

BT - EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings

ER -

Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications

Abstract

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