This article presents the innovative manufacturing and 3-dimensional packaging of a miniaturized ultrasonic transducer for medical applications. A spirally rolled-up flexible circuit was employed for the interconnection of a linear transducer array to be used in a needle size footprint. Photolithography, precision dicing and low temperature conductive bonding are amongst the technologies under investigation for the realization of this high frequency ultrasound device.
|Title of host publication||EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings|
|Publication status||Published - 1 Jan 2011|