Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers

J. H.-G. Ng, R. T. Ssekitoleko, H.-V. Nguyen, K. E. Aasmundtveit, C. E. M. Demore, S. Cochran, M. P. Y. Desmulliez

    Research output: Contribution to conferencePaper

    Original languageEnglish
    Publication statusPublished - 2012
    Event14th International Conference on Electronic Materials and Packaging, EMAP 2012 - Lantau Island, Hong Kong
    Duration: 13 Dec 201216 Dec 2012

    Conference

    Conference14th International Conference on Electronic Materials and Packaging, EMAP 2012
    CountryHong Kong
    CityLantau Island
    Period13/12/1216/12/12

    Research Output

    • 1 Conference contribution

    Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers

    Ng, J. H-G., Ssekitoleko, R. T., Nguyen, H-V., Aasmundtveit, K. E., Demore, C. E. M., Cochran, S. & Desmulliez, M. P. Y., 2012, 14th International Conference on Electronic Materials and Packaging, EMAP 2012: Proceedings. Piscataway, N.J.: IEEE, p. Article 6507902

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Activities

    • 2 Participation in conference

    14th International Conference on Electronic Materials and Packaging, EMAP 2012

    Sandy Cochran (Participant)

    15 Dec 2012

    Activity: Participating in or organising an event typesParticipation in conference

    14th International Conference on Electronic Materials and Packaging, EMAP 2012

    Christine E. M. Demore (Participant)

    15 Dec 2012

    Activity: Participating in or organising an event typesParticipation in conference

    Cite this

    Ng, J. H-G., Ssekitoleko, R. T., Nguyen, H-V., Aasmundtveit, K. E., Demore, C. E. M., Cochran, S., & Desmulliez, M. P. Y. (2012). Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers. Paper presented at 14th International Conference on Electronic Materials and Packaging, EMAP 2012, Lantau Island, Hong Kong. http://ihome.ust.hk/~emap2012/