Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers

J. H.-G. Ng, R. T. Ssekitoleko, Hoang-Vu Nguyen, K. E. Aasmundtveit, C. E. M. Demore, S. Cochran, M. P. Y. Desmulliez

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    The realization of the next-generation miniaturized ultrasound transducers comprising of fine pitch array elements requires packaging techniques used in the microelectronics industry. In addition, new types of piezoelectric materials are used to enhance the acoustic performance of these transducers, but these materials cannot withstand the temperature and pressure applied in conventional bonding technologies. This paper explored two different bonding techniques specifically to address this issue.
    Original languageEnglish
    Title of host publication14th International Conference on Electronic Materials and Packaging, EMAP 2012
    Subtitle of host publicationProceedings
    Place of PublicationPiscataway, N.J.
    PublisherIEEE
    PagesArticle 6507902
    ISBN (Print)9781467349444, 9781467349451
    DOIs
    Publication statusPublished - 2012
    Event14th International Conference on Electronic Materials and Packaging, EMAP 2012 - Lantau Island, Hong Kong
    Duration: 13 Dec 201216 Dec 2012

    Conference

    Conference14th International Conference on Electronic Materials and Packaging, EMAP 2012
    CountryHong Kong
    CityLantau Island
    Period13/12/1216/12/12

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  • Research Output

    Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers

    Ng, J. H-G., Ssekitoleko, R. T., Nguyen, H-V., Aasmundtveit, K. E., Demore, C. E. M., Cochran, S. & Desmulliez, M. P. Y., 2012.

    Research output: Contribution to conferencePaper

    Activities

    • 2 Participation in conference

    14th International Conference on Electronic Materials and Packaging, EMAP 2012

    Sandy Cochran (Participant)

    15 Dec 2012

    Activity: Participating in or organising an event typesParticipation in conference

    14th International Conference on Electronic Materials and Packaging, EMAP 2012

    Christine E. M. Demore (Participant)

    15 Dec 2012

    Activity: Participating in or organising an event typesParticipation in conference

    Cite this

    Ng, J. H-G., Ssekitoleko, R. T., Nguyen, H-V., Aasmundtveit, K. E., Demore, C. E. M., Cochran, S., & Desmulliez, M. P. Y. (2012). Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers. In 14th International Conference on Electronic Materials and Packaging, EMAP 2012: Proceedings (pp. Article 6507902). IEEE. https://doi.org/10.1109/EMAP.2012.6507902