Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers

J. H.-G. Ng; R. T. Ssekitoleko; Hoang-Vu Nguyen; K. E. Aasmundtveit; C. E. M. Demore; S. Cochran; M. P. Y. Desmulliez

doi:10.1109/EMAP.2012.6507902

Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers

J. H.-G. Ng
, R. T. Ssekitoleko
, Hoang-Vu Nguyen
, K. E. Aasmundtveit
, C. E. M. Demore
, S. Cochran
, M. P. Y. Desmulliez

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The realization of the next-generation miniaturized ultrasound transducers comprising of fine pitch array elements requires packaging techniques used in the microelectronics industry. In addition, new types of piezoelectric materials are used to enhance the acoustic performance of these transducers, but these materials cannot withstand the temperature and pressure applied in conventional bonding technologies. This paper explored two different bonding techniques specifically to address this issue.

Original language	English
Title of host publication	14th International Conference on Electronic Materials and Packaging, EMAP 2012
Subtitle of host publication	Proceedings
Place of Publication	Piscataway, N.J.
Publisher	IEEE
Pages	Article 6507902
ISBN (Print)	9781467349444, 9781467349451
DOIs	https://doi.org/10.1109/EMAP.2012.6507902
Publication status	Published - 2012
Event	14th International Conference on Electronic Materials and Packaging, EMAP 2012 - Lantau Island, Hong Kong Duration: 13 Dec 2012 → 16 Dec 2012

Conference

Conference	14th International Conference on Electronic Materials and Packaging, EMAP 2012
Country/Territory	Hong Kong
City	Lantau Island
Period	13/12/12 → 16/12/12

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10.1109/EMAP.2012.6507902

Cite this

Ng, J. H.-G., Ssekitoleko, R. T., Nguyen, H.-V., Aasmundtveit, K. E., Demore, C. E. M., Cochran, S., & Desmulliez, M. P. Y. (2012). Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers. In 14th International Conference on Electronic Materials and Packaging, EMAP 2012: Proceedings (pp. Article 6507902). IEEE. https://doi.org/10.1109/EMAP.2012.6507902

@inproceedings{44c5b4f336604857b8a7a7ccb2586bc0,

title = "Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers",

abstract = "The realization of the next-generation miniaturized ultrasound transducers comprising of fine pitch array elements requires packaging techniques used in the microelectronics industry. In addition, new types of piezoelectric materials are used to enhance the acoustic performance of these transducers, but these materials cannot withstand the temperature and pressure applied in conventional bonding technologies. This paper explored two different bonding techniques specifically to address this issue.",

author = "Ng, \{J. H.-G.\} and Ssekitoleko, \{R. T.\} and Hoang-Vu Nguyen and Aasmundtveit, \{K. E.\} and Demore, \{C. E. M.\} and S. Cochran and Desmulliez, \{M. P. Y.\}",

year = "2012",

doi = "10.1109/EMAP.2012.6507902",

language = "English",

isbn = "9781467349444",

pages = "Article 6507902",

booktitle = "14th International Conference on Electronic Materials and Packaging, EMAP 2012",

publisher = "IEEE",

note = "14th International Conference on Electronic Materials and Packaging, EMAP 2012 ; Conference date: 13-12-2012 Through 16-12-2012",

}

Ng, JH-G, Ssekitoleko, RT, Nguyen, H-V, Aasmundtveit, KE, Demore, CEM, Cochran, S & Desmulliez, MPY 2012, Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers. in 14th International Conference on Electronic Materials and Packaging, EMAP 2012: Proceedings. IEEE, Piscataway, N.J., pp. Article 6507902, 14th International Conference on Electronic Materials and Packaging, EMAP 2012, Lantau Island, Hong Kong, 13/12/12. https://doi.org/10.1109/EMAP.2012.6507902

Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers. / Ng, J. H.-G.; Ssekitoleko, R. T.; Nguyen, Hoang-Vu et al.
14th International Conference on Electronic Materials and Packaging, EMAP 2012: Proceedings. Piscataway, N.J.: IEEE, 2012. p. Article 6507902.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers

AU - Ng, J. H.-G.

AU - Ssekitoleko, R. T.

AU - Nguyen, Hoang-Vu

AU - Aasmundtveit, K. E.

AU - Demore, C. E. M.

AU - Cochran, S.

AU - Desmulliez, M. P. Y.

PY - 2012

Y1 - 2012

N2 - The realization of the next-generation miniaturized ultrasound transducers comprising of fine pitch array elements requires packaging techniques used in the microelectronics industry. In addition, new types of piezoelectric materials are used to enhance the acoustic performance of these transducers, but these materials cannot withstand the temperature and pressure applied in conventional bonding technologies. This paper explored two different bonding techniques specifically to address this issue.

AB - The realization of the next-generation miniaturized ultrasound transducers comprising of fine pitch array elements requires packaging techniques used in the microelectronics industry. In addition, new types of piezoelectric materials are used to enhance the acoustic performance of these transducers, but these materials cannot withstand the temperature and pressure applied in conventional bonding technologies. This paper explored two different bonding techniques specifically to address this issue.

UR - https://www.scopus.com/pages/publications/84880280475

U2 - 10.1109/EMAP.2012.6507902

DO - 10.1109/EMAP.2012.6507902

M3 - Conference contribution

AN - SCOPUS:84880280475

SN - 9781467349444

SN - 9781467349451

SP - Article 6507902

BT - 14th International Conference on Electronic Materials and Packaging, EMAP 2012

PB - IEEE

CY - Piscataway, N.J.

T2 - 14th International Conference on Electronic Materials and Packaging, EMAP 2012

Y2 - 13 December 2012 through 16 December 2012

ER -

Ng JHG, Ssekitoleko RT, Nguyen HV, Aasmundtveit KE, Demore CEM, Cochran S et al. Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers. In 14th International Conference on Electronic Materials and Packaging, EMAP 2012: Proceedings. Piscataway, N.J.: IEEE. 2012. p. Article 6507902 doi: 10.1109/EMAP.2012.6507902

Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers

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