Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers

J. H.-G. Ng; R. T. Ssekitoleko; H.-V. Nguyen; K. E. Aasmundtveit; C. E. M. Demore; S. Cochran; M. P. Y. Desmulliez

Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers

J. H.-G. Ng, R. T. Ssekitoleko, H.-V. Nguyen, K. E. Aasmundtveit, C. E. M. Demore, S. Cochran, M. P. Y. Desmulliez

Research output: Contribution to conference › Paper

Original language	English
Publication status	Published - 2012
Event	14th International Conference on Electronic Materials and Packaging, EMAP 2012 - Lantau Island, Hong Kong Duration: 13 Dec 2012 → 16 Dec 2012

Conference

Conference	14th International Conference on Electronic Materials and Packaging, EMAP 2012
Country/Territory	Hong Kong
City	Lantau Island
Period	13/12/12 → 16/12/12

Access to Document

http://ihome.ust.hk/~emap2012/

Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers
Ng, J.H.-G., Ssekitoleko, R. T., Nguyen, H.-V., Aasmundtveit, K. E., Demore, C. E. M., Cochran, S. & Desmulliez, M. P. Y., 2012, 14th International Conference on Electronic Materials and Packaging, EMAP 2012: Proceedings. Piscataway, N.J.: IEEE, p. Article 6507902
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

14th International Conference on Electronic Materials and Packaging, EMAP 2012
Cochran, S. (Participant)
15 Dec 2012
Activity: Participating in or organising an event types › Participation in conference
14th International Conference on Electronic Materials and Packaging, EMAP 2012
Demore, C. E. M. (Participant)
15 Dec 2012
Activity: Participating in or organising an event types › Participation in conference

Cite this

Ng, J. H.-G., Ssekitoleko, R. T., Nguyen, H.-V., Aasmundtveit, K. E., Demore, C. E. M., Cochran, S., & Desmulliez, M. P. Y. (2012). Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers. Paper presented at 14th International Conference on Electronic Materials and Packaging, EMAP 2012, Lantau Island, Hong Kong. http://ihome.ust.hk/~emap2012/

@conference{f34cdc4d1777485c88d9d5154b181a77,

title = "Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers",

author = "Ng, \{J. H.-G.\} and Ssekitoleko, \{R. T.\} and H.-V. Nguyen and Aasmundtveit, \{K. E.\} and Demore, \{C. E. M.\} and S. Cochran and Desmulliez, \{M. P. Y.\}",

year = "2012",

language = "English",

note = "14th International Conference on Electronic Materials and Packaging, EMAP 2012 ; Conference date: 13-12-2012 Through 16-12-2012",

}

Ng, JH-G, Ssekitoleko, RT, Nguyen, H-V, Aasmundtveit, KE, Demore, CEM, Cochran, S & Desmulliez, MPY 2012, 'Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers', Paper presented at 14th International Conference on Electronic Materials and Packaging, EMAP 2012, Lantau Island, Hong Kong, 13/12/12 - 16/12/12. <http://ihome.ust.hk/~emap2012/>

TY - CONF

T1 - Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers

AU - Ng, J. H.-G.

AU - Ssekitoleko, R. T.

AU - Nguyen, H.-V.

AU - Aasmundtveit, K. E.

AU - Demore, C. E. M.

AU - Cochran, S.

AU - Desmulliez, M. P. Y.

PY - 2012

Y1 - 2012

M3 - Paper

T2 - 14th International Conference on Electronic Materials and Packaging, EMAP 2012

Y2 - 13 December 2012 through 16 December 2012

ER -

Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers

Conference

Access to Document

Research output

Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers

Activities

14th International Conference on Electronic Materials and Packaging, EMAP 2012

14th International Conference on Electronic Materials and Packaging, EMAP 2012

Cite this