MACFEST: Benchmarking a new solder-able finish for the PCB industry

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	13-19
Number of pages	7
Journal	Journal of the Institute of Circuit Technology
Volume	10
Issue number	1
Publication status	Published - 2017

Cite this

@article{257aa7447017439986881f4f2f154d46,

title = "MACFEST: Benchmarking a new solder-able finish for the PCB industry",

author = "Thomas Jones",

year = "2017",

language = "English",

volume = "10",

pages = "13--19",

journal = "Journal of the Institute of Circuit Technology",

publisher = "Institute of Circuit Technology",

number = "1",

}