Megasonic (1MHz) acoustic agitation has been applied to Printed Circuit Board (PCB) surfaces to aid copper electroplating efficiency through enhancement of electrolyte solution transport. Evidence for microbubble acoustic transient cavitation has been observed on the PCB surface, which is attributed as the cause of adverse plating finishes. Additional acoustic artefacts are reported as ridge-like structures of peak-to-trough of 20 µm and are associated with the possible occurrence of Rayleigh-wave surface acoustic waves.
|Title of host publication||2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)|
|Place of Publication||United States|
|Number of pages||4|
|Publication status||Published - 2 Jun 2016|
- Megasonic agitation, Electroplating, Manufacturing