Megasound Acoustic Surface Treatment Process in the Printed Circuit Board Industry

Thomas Jones; David Flynn; Marc Phillipe Yves Desmulliez

doi:10.1109/DTIP.2016.7514855

Megasound Acoustic Surface Treatment Process in the Printed Circuit Board Industry

Thomas Jones, David Flynn, Marc Phillipe Yves Desmulliez

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

Megasonic (1MHz) acoustic agitation has been applied to Printed Circuit Board (PCB) surfaces to aid copper electroplating efficiency through enhancement of electrolyte solution transport. Evidence for microbubble acoustic transient cavitation has been observed on the PCB surface, which is attributed as the cause of adverse plating finishes. Additional acoustic artefacts are reported as ridge-like structures of peak-to-trough of 20 µm and are associated with the possible occurrence of Rayleigh-wave surface acoustic waves.

Original language	English
Title of host publication	2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
Place of Publication	United States
Publisher	IEEE
Number of pages	4
ISBN (Print)	9781509014576
DOIs	https://doi.org/10.1109/DTIP.2016.7514855
Publication status	Published - 2 Jun 2016

Keywords

Megasonic agitation, Electroplating, Manufacturing

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10.1109/DTIP.2016.7514855

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title = "Megasound Acoustic Surface Treatment Process in the Printed Circuit Board Industry",

abstract = "Megasonic (1MHz) acoustic agitation has been applied to Printed Circuit Board (PCB) surfaces to aid copper electroplating efficiency through enhancement of electrolyte solution transport. Evidence for microbubble acoustic transient cavitation has been observed on the PCB surface, which is attributed as the cause of adverse plating finishes. Additional acoustic artefacts are reported as ridge-like structures of peak-to-trough of 20 µm and are associated with the possible occurrence of Rayleigh-wave surface acoustic waves.",

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author = "Thomas Jones and David Flynn and Desmulliez, {Marc Phillipe Yves}",

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AU - Flynn, David

AU - Desmulliez, Marc Phillipe Yves

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N2 - Megasonic (1MHz) acoustic agitation has been applied to Printed Circuit Board (PCB) surfaces to aid copper electroplating efficiency through enhancement of electrolyte solution transport. Evidence for microbubble acoustic transient cavitation has been observed on the PCB surface, which is attributed as the cause of adverse plating finishes. Additional acoustic artefacts are reported as ridge-like structures of peak-to-trough of 20 µm and are associated with the possible occurrence of Rayleigh-wave surface acoustic waves.

AB - Megasonic (1MHz) acoustic agitation has been applied to Printed Circuit Board (PCB) surfaces to aid copper electroplating efficiency through enhancement of electrolyte solution transport. Evidence for microbubble acoustic transient cavitation has been observed on the PCB surface, which is attributed as the cause of adverse plating finishes. Additional acoustic artefacts are reported as ridge-like structures of peak-to-trough of 20 µm and are associated with the possible occurrence of Rayleigh-wave surface acoustic waves.

KW - Megasonic agitation, Electroplating, Manufacturing

U2 - 10.1109/DTIP.2016.7514855

DO - 10.1109/DTIP.2016.7514855

M3 - Conference contribution

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BT - 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

PB - IEEE

CY - United States

ER -

Megasound Acoustic Surface Treatment Process in the Printed Circuit Board Industry

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Keywords

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