Megasound Acoustic Surface Treatment Process in the Printed Circuit Board Industry

Thomas Jones, David Flynn, Marc Phillipe Yves Desmulliez

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Megasonic (1MHz) acoustic agitation has been applied to Printed Circuit Board (PCB) surfaces to aid copper electroplating efficiency through enhancement of electrolyte solution transport. Evidence for microbubble acoustic transient cavitation has been observed on the PCB surface, which is attributed as the cause of adverse plating finishes. Additional acoustic artefacts are reported as ridge-like structures of peak-to-trough of 20 µm and are associated with the possible occurrence of Rayleigh-wave surface acoustic waves.
Original languageEnglish
Title of host publication2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
Place of PublicationUnited States
PublisherWiley-IEEE Press
Number of pages4
ISBN (Print)9781509014576
DOIs
Publication statusPublished - 2 Jun 2016

    Fingerprint

Keywords

  • Megasonic agitation, Electroplating, Manufacturing

Cite this

Jones, T., Flynn, D., & Desmulliez, M. P. Y. (2016). Megasound Acoustic Surface Treatment Process in the Printed Circuit Board Industry. In 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) [16156857] Wiley-IEEE Press. https://doi.org/10.1109/DTIP.2016.7514855