Optimized surface silylation of chemically amplified epoxidized photoresists for micromachining applications

TY - JOUR

T1 - Optimized surface silylation of chemically amplified epoxidized photoresists for micromachining applications

AU - Kontziampasis, D.

AU - Beltsios, K.

AU - Tegou, E.

AU - Argitis, P.

AU - Gogolides, E.

N1 - Funding Information: European Union (EU) Information and Communication Technologies (ICT) project “157 CRISPIES”. Grant Number: 30143; EU Joined ICT/NMP2 (Nanotechnologies, Materials and Production) project “Nanoplasma”. Grant Number: 016424. Copyright: © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010.

PY - 2010/8/15

Y1 - 2010/8/15

N2 - We explored the selective wet silylation of noncrosslinked areas of epoxidized photoresists using chlorosilanes. Emphasis was placed on the Si uptake of the epoxy films when controlled low levels of water were incorporated into the silylation solution. Fourier transform infrared measurements and oxygen-plasma resistance data with in situ laser interferometry and multiwavelength ellipsometry are presented. The fine tuning of the moisture level was found to be crucial for the generation of satisfactory and reproducible structures. The optimized version of the process was shown to be useful for epoxy-based dry micromachining. Overall, an attractive positive-tone process is presented as an alternative to the usual negative-tone process for commercial epoxy resists.

AB - We explored the selective wet silylation of noncrosslinked areas of epoxidized photoresists using chlorosilanes. Emphasis was placed on the Si uptake of the epoxy films when controlled low levels of water were incorporated into the silylation solution. Fourier transform infrared measurements and oxygen-plasma resistance data with in situ laser interferometry and multiwavelength ellipsometry are presented. The fine tuning of the moisture level was found to be crucial for the generation of satisfactory and reproducible structures. The optimized version of the process was shown to be useful for epoxy-based dry micromachining. Overall, an attractive positive-tone process is presented as an alternative to the usual negative-tone process for commercial epoxy resists.

KW - functionalization of polymers

KW - microstructure

KW - photoresists

KW - selectivity

UR - https://www.scopus.com/pages/publications/77952273738

U2 - 10.1002/app.31644

DO - 10.1002/app.31644

M3 - Article

SN - 0021-8995

VL - 117

SP - 2189

EP - 2195

JO - Journal of Applied Polymer Science

JF - Journal of Applied Polymer Science

IS - 4

ER -