Progress towards the development of novel fabrication and assembly methods for the next generation of ultrasonic transducers

Jack Hoyd-Gigg Ng; David Flynn; Yves Lacrotte; Marc P.Y. Desmulliez; Robert Ssekitoleko; Christine Démoré; Sandra Cochran

doi:10.1109/ESTC.2010.5642978

Progress towards the development of novel fabrication and assembly methods for the next generation of ultrasonic transducers

Jack Hoyd-Gigg Ng, David Flynn, Yves Lacrotte, Marc P.Y. Desmulliez, Robert Ssekitoleko, Christine Démoré, Sandra Cochran

Research output: Chapter in Book/Report/Conference proceeding › Other chapter contribution

4 Citations (Scopus)

Abstract

The development trends of ultrasonic devices dictate that frequencies increase, electrode element counts increase, and element pitch dimensions shrink. The high density of the small pitch electrode elements combined with the challenging geometry of the device design, and considerations of acoustic impedance and signal interference, mean that new assembly and packaging techniques are required to be developed to form the interconnection between the high frequency ultrasound (HFUS) arrays and external circuitry. Novel assembly methods using photolithography of new epoxy composite alumina/SU-8 and high density flexible circuits, precision dicing of lead zirconate titanate (PZT) material, flexible circuits and SU-8 resin, powder blasting for vias structuring, and conductive and adhesive films bonding are considered as a mass-scale production approach.

Original language	English
Title of host publication	Electronics System Integration Technology Conference, ESTC 2010 - Proceedings
DOIs	https://doi.org/10.1109/ESTC.2010.5642978
Publication status	Published - 1 Jan 2010

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10.1109/ESTC.2010.5642978

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abstract = "The development trends of ultrasonic devices dictate that frequencies increase, electrode element counts increase, and element pitch dimensions shrink. The high density of the small pitch electrode elements combined with the challenging geometry of the device design, and considerations of acoustic impedance and signal interference, mean that new assembly and packaging techniques are required to be developed to form the interconnection between the high frequency ultrasound (HFUS) arrays and external circuitry. Novel assembly methods using photolithography of new epoxy composite alumina/SU-8 and high density flexible circuits, precision dicing of lead zirconate titanate (PZT) material, flexible circuits and SU-8 resin, powder blasting for vias structuring, and conductive and adhesive films bonding are considered as a mass-scale production approach.",

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AU - Ng, Jack Hoyd-Gigg

AU - Flynn, David

AU - Lacrotte, Yves

AU - Desmulliez, Marc P.Y.

AU - Ssekitoleko, Robert

AU - Démoré, Christine

AU - Cochran, Sandra

PY - 2010/1/1

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N2 - The development trends of ultrasonic devices dictate that frequencies increase, electrode element counts increase, and element pitch dimensions shrink. The high density of the small pitch electrode elements combined with the challenging geometry of the device design, and considerations of acoustic impedance and signal interference, mean that new assembly and packaging techniques are required to be developed to form the interconnection between the high frequency ultrasound (HFUS) arrays and external circuitry. Novel assembly methods using photolithography of new epoxy composite alumina/SU-8 and high density flexible circuits, precision dicing of lead zirconate titanate (PZT) material, flexible circuits and SU-8 resin, powder blasting for vias structuring, and conductive and adhesive films bonding are considered as a mass-scale production approach.

AB - The development trends of ultrasonic devices dictate that frequencies increase, electrode element counts increase, and element pitch dimensions shrink. The high density of the small pitch electrode elements combined with the challenging geometry of the device design, and considerations of acoustic impedance and signal interference, mean that new assembly and packaging techniques are required to be developed to form the interconnection between the high frequency ultrasound (HFUS) arrays and external circuitry. Novel assembly methods using photolithography of new epoxy composite alumina/SU-8 and high density flexible circuits, precision dicing of lead zirconate titanate (PZT) material, flexible circuits and SU-8 resin, powder blasting for vias structuring, and conductive and adhesive films bonding are considered as a mass-scale production approach.

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M3 - Other chapter contribution

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BT - Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

ER -

Progress towards the development of novel fabrication and assembly methods for the next generation of ultrasonic transducers

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