This article presents a selective metallization method for the newly developed 3D printable thermoplastic polyurethane elastomers (TPU): FilaFlex®, SemiFlex™, PolyFlex™ and NinjaFlex®. Silver nanoparticles were fabricated in-situ by photo-reduction on the surface of TPUs and acted as catalysts for copper ion adsorption. This method demonstrates the successful fabrication of copper patterns on flexible TPU filaments. Furthermore, Polyflex™ and acrylonitrile butadiene styrene (ABS) filaments printed in the same part have been used to enable selective electroless plating directly on Polyflex™ material. Electroless copper deposited onto Polyflex™ has a sheet resistance of (139.4 ± 7.2) mΩ/☐ and a copper conductivity of (1.1 ± 0.1) × 107 S/m that is comparable to bulk copper. Copper-plated Polyflex™ interconnects were fabricated as a proof of concept demonstrators.
|Number of pages||9|
|Early online date||29 Jul 2019|
|Publication status||Published - 14 Aug 2019|
- Thermoplastic polyurethane elastomers (TPU)
- fused filament fabrication (FFF)
- 3D printing
- additive manufacturing (AM)
- silver nanoparticles (Ag NPs)
- electroless copper plating
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- Mechanical and Electronic Engineering - Baxter Fellow (Teaching and Research)