Selective Metallization of 3D Printable Thermoplastic Polyurethanes

Assel Ryspayeva; Thomas D. A. Jones; Sadeque Reza Khan; Mohammadreza Nekouie Esfahani; Matthew P. Shuttleworth; Russell A. Harris; Robert W. Kay; Marc Phillipe Yves Desmulliez; Jose Marques-Hueso

doi:10.1109/access.2019.2931594

Selective Metallization of 3D Printable Thermoplastic Polyurethanes

Assel Ryspayeva, Thomas D. A. Jones, Sadeque Reza Khan, Mohammadreza Nekouie Esfahani, Matthew P. Shuttleworth, Russell A. Harris, Robert W. Kay, Marc Phillipe Yves Desmulliez, Jose Marques-Hueso

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Abstract

This article presents a selective metallization method for the newly developed 3D printable thermoplastic polyurethane elastomers (TPU): FilaFlex®, SemiFlex™, PolyFlex™ and NinjaFlex®. Silver nanoparticles were fabricated in-situ by photo-reduction on the surface of TPUs and acted as catalysts for copper ion adsorption. This method demonstrates the successful fabrication of copper patterns on flexible TPU filaments. Furthermore, Polyflex™ and acrylonitrile butadiene styrene (ABS) filaments printed in the same part have been used to enable selective electroless plating directly on Polyflex™ material. Electroless copper deposited onto Polyflex™ has a sheet resistance of (139.4 ± 7.2) mΩ/☐ and a copper conductivity of (1.1 ± 0.1) × 107 S/m that is comparable to bulk copper. Copper-plated Polyflex™ interconnects were fabricated as a proof of concept demonstrators.

Original language	English
Number of pages	9
Journal	IEEE Access
Volume	7
Issue number	2019
Early online date	29 Jul 2019
DOIs	https://doi.org/10.1109/access.2019.2931594
Publication status	Published - 14 Aug 2019

Keywords

Thermoplastic polyurethane elastomers (TPU)
fused filament fabrication (FFF)
3D printing
additive manufacturing (AM)
hybrid-AM
silver nanoparticles (Ag NPs)
electroless copper plating
FilaFlex®
SemiFlex™
PolyFlex™
NinjaFlex®

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10.1109/access.2019.2931594Licence: CC BY

Final Published VersionFinal published version, 15 MBLicence: CC BY

Jones, Thomas
- Mechanical and Industrial Engineering - Baxter Fellow (Teaching and Research)
Person: Academic

Cite this

@article{0fccd10290e24950b99cbd0635c90352,

title = "Selective Metallization of 3D Printable Thermoplastic Polyurethanes",

abstract = "This article presents a selective metallization method for the newly developed 3D printable thermoplastic polyurethane elastomers (TPU): FilaFlex{\textregistered}, SemiFlex{\texttrademark}, PolyFlex{\texttrademark} and NinjaFlex{\textregistered}. Silver nanoparticles were fabricated in-situ by photo-reduction on the surface of TPUs and acted as catalysts for copper ion adsorption. This method demonstrates the successful fabrication of copper patterns on flexible TPU filaments. Furthermore, Polyflex{\texttrademark} and acrylonitrile butadiene styrene (ABS) filaments printed in the same part have been used to enable selective electroless plating directly on Polyflex{\texttrademark} material. Electroless copper deposited onto Polyflex{\texttrademark} has a sheet resistance of (139.4 ± 7.2) mΩ/☐ and a copper conductivity of (1.1 ± 0.1) × 107 S/m that is comparable to bulk copper. Copper-plated Polyflex{\texttrademark} interconnects were fabricated as a proof of concept demonstrators.",

keywords = "Thermoplastic polyurethane elastomers (TPU), fused filament fabrication (FFF), 3D printing, additive manufacturing (AM), hybrid-AM, silver nanoparticles (Ag NPs), electroless copper plating, FilaFlex{\textregistered}, SemiFlex{\texttrademark}, PolyFlex{\texttrademark}, NinjaFlex{\textregistered}",

author = "Assel Ryspayeva and Jones, {Thomas D. A.} and Khan, {Sadeque Reza} and {Nekouie Esfahani}, Mohammadreza and Shuttleworth, {Matthew P.} and Harris, {Russell A.} and Kay, {Robert W.} and Desmulliez, {Marc Phillipe Yves} and Jose Marques-Hueso",

note = "This work was supported by the Engineering and Physical Sciences Research Council (EPSRC) through the Grant Photobioform II under Grant EP/N018222/1 and Grant EP/N018265/2. ",

year = "2019",

month = aug,

day = "14",

doi = "10.1109/access.2019.2931594",

language = "English",

volume = "7",

journal = "IEEE Access",

issn = "2169-3536",

publisher = "Institute of Electrical and Electronics Engineers",

number = "2019",

}

TY - JOUR

T1 - Selective Metallization of 3D Printable Thermoplastic Polyurethanes

AU - Ryspayeva, Assel

AU - Jones, Thomas D. A.

AU - Khan, Sadeque Reza

AU - Nekouie Esfahani, Mohammadreza

AU - Shuttleworth, Matthew P.

AU - Harris, Russell A.

AU - Kay, Robert W.

AU - Desmulliez, Marc Phillipe Yves

AU - Marques-Hueso, Jose

N1 - This work was supported by the Engineering and Physical Sciences Research Council (EPSRC) through the Grant Photobioform II under Grant EP/N018222/1 and Grant EP/N018265/2.

PY - 2019/8/14

Y1 - 2019/8/14

N2 - This article presents a selective metallization method for the newly developed 3D printable thermoplastic polyurethane elastomers (TPU): FilaFlex®, SemiFlex™, PolyFlex™ and NinjaFlex®. Silver nanoparticles were fabricated in-situ by photo-reduction on the surface of TPUs and acted as catalysts for copper ion adsorption. This method demonstrates the successful fabrication of copper patterns on flexible TPU filaments. Furthermore, Polyflex™ and acrylonitrile butadiene styrene (ABS) filaments printed in the same part have been used to enable selective electroless plating directly on Polyflex™ material. Electroless copper deposited onto Polyflex™ has a sheet resistance of (139.4 ± 7.2) mΩ/☐ and a copper conductivity of (1.1 ± 0.1) × 107 S/m that is comparable to bulk copper. Copper-plated Polyflex™ interconnects were fabricated as a proof of concept demonstrators.

AB - This article presents a selective metallization method for the newly developed 3D printable thermoplastic polyurethane elastomers (TPU): FilaFlex®, SemiFlex™, PolyFlex™ and NinjaFlex®. Silver nanoparticles were fabricated in-situ by photo-reduction on the surface of TPUs and acted as catalysts for copper ion adsorption. This method demonstrates the successful fabrication of copper patterns on flexible TPU filaments. Furthermore, Polyflex™ and acrylonitrile butadiene styrene (ABS) filaments printed in the same part have been used to enable selective electroless plating directly on Polyflex™ material. Electroless copper deposited onto Polyflex™ has a sheet resistance of (139.4 ± 7.2) mΩ/☐ and a copper conductivity of (1.1 ± 0.1) × 107 S/m that is comparable to bulk copper. Copper-plated Polyflex™ interconnects were fabricated as a proof of concept demonstrators.

KW - Thermoplastic polyurethane elastomers (TPU)

KW - fused filament fabrication (FFF)

KW - 3D printing

KW - additive manufacturing (AM)

KW - hybrid-AM

KW - silver nanoparticles (Ag NPs)

KW - electroless copper plating

KW - FilaFlex®

KW - SemiFlex™

KW - PolyFlex™

KW - NinjaFlex®

U2 - 10.1109/access.2019.2931594

DO - 10.1109/access.2019.2931594

M3 - Article

SN - 2169-3536

VL - 7

JO - IEEE Access

JF - IEEE Access

IS - 2019

ER -

Selective Metallization of 3D Printable Thermoplastic Polyurethanes

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Jones, Thomas

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