Simulation of laser ultrasonic surface wave dispersion in a multilayered skin model

Adèle L'Etang, Zhihong Huang, Di Yang

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)

    Abstract

    The need for a sensitive method of the non-destructive evaluation of skin layer properties is highly desirable in a number of medical applications. The use of laser-generated surface acoustic waves (SAW) for the characterisation of multi-layered materials is widely used in industrial applications. In this paper we present research expanding this principle for the use of generated SAW for the characterisation of skin layer properties. The SAW dispersion relations are calculated for finite element simulated SAW displacement waveforms over a range of source-detector separations in three-layered models of human skin. The simulations show that SAWs are extremely sensitive to changes in layer properties and will be able to be utilised to quantitively characterise the layer properties of human skin by the development of an inverse algorithm.
    Original languageEnglish
    Title of host publicationEngineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
    PublisherIEEE Computer Society
    Pages5072-5075
    Number of pages4
    ISBN (Print)1-4244-0032-5, 978-142440032-4
    DOIs
    Publication statusPublished - 2006
    Event28th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS'06 - New York, United States
    Duration: 30 Aug 20093 Sep 2009

    Conference

    Conference28th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS'06
    CountryUnited States
    CityNew York
    Period30/08/093/09/09

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    L'Etang, A., Huang, Z., & Yang, D. (2006). Simulation of laser ultrasonic surface wave dispersion in a multilayered skin model. In Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE (pp. 5072-5075). IEEE Computer Society. https://doi.org/10.1109/IEMBS.2006.260256