Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays

A. L. Bernassau; S. McKay; D. Hutson; C. E. M. Demore; L. Garcia-Gancedo; T. W. Button; J. J. McAneny; Sandy Cochran

doi:10.1109/ULTSYM.2007.37

Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays

A. L. Bernassau, S. McKay, D. Hutson, C. E. M. Demore, L. Garcia-Gancedo, T. W. Button, J. J. McAneny, Sandy Cochran

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

8 Citations (Scopus)

Abstract

A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires planar, parallel and smooth surfaces. This paper reports an investigation of the surface finishing of 1-3 piezocomposite material by mechanical lapping and/polishing that has demonstrated that excellent surface flatness can be obtained. Subsequently, high frequency array elements have been fabricated on these surfaces using a low temperature lift-off photolithography process. A 50 MHz linear array with 30 pm element pitch has been patterned on the lapped and polished surface of a low frequency 1-3 piezocomposite. Good electrode edge definition and electrical contact to the composite were obtained. Additionally, patterning has been demonstrated on a fine-scale composite, itself suitable for operation above 30 MHz.

Original language	English
Title of host publication	2007 IEEE ULTRASONICS SYMPOSIUM PROCEEDINGS, VOLS 1-6
Place of Publication	New York
Publisher	IEEE Computer Society
Pages	96-99
Number of pages	4
ISBN (Print)	9781424413836
DOIs	https://doi.org/10.1109/ULTSYM.2007.37
Publication status	Published - 2007
Event	2007 IEEE International Ultrasonics Symposium (IUS) - New York, United States Duration: 28 Oct 2007 → 31 Oct 2007 http://ewh.ieee.org/conf/ius_2007/

Conference

Conference	2007 IEEE International Ultrasonics Symposium (IUS)
Abbreviated title	2007 IEEE IUS
Country/Territory	United States
City	New York
Period	28/10/07 → 31/10/07
Internet address	http://ewh.ieee.org/conf/ius_2007/

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10.1109/ULTSYM.2007.37

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Bernassau, A. L., McKay, S., Hutson, D., Demore, C. E. M., Garcia-Gancedo, L., Button, T. W., McAneny, J. J., & Cochran, S. (2007). Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays. In 2007 IEEE ULTRASONICS SYMPOSIUM PROCEEDINGS, VOLS 1-6 (pp. 96-99). IEEE Computer Society. https://doi.org/10.1109/ULTSYM.2007.37

@inproceedings{06756e53db86445f8e9aad0733c147e2,

title = "Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays",

abstract = "A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires planar, parallel and smooth surfaces. This paper reports an investigation of the surface finishing of 1-3 piezocomposite material by mechanical lapping and/polishing that has demonstrated that excellent surface flatness can be obtained. Subsequently, high frequency array elements have been fabricated on these surfaces using a low temperature lift-off photolithography process. A 50 MHz linear array with 30 pm element pitch has been patterned on the lapped and polished surface of a low frequency 1-3 piezocomposite. Good electrode edge definition and electrical contact to the composite were obtained. Additionally, patterning has been demonstrated on a fine-scale composite, itself suitable for operation above 30 MHz.",

author = "Bernassau, {A. L.} and S. McKay and D. Hutson and Demore, {C. E. M.} and L. Garcia-Gancedo and Button, {T. W.} and McAneny, {J. J.} and Sandy Cochran",

year = "2007",

doi = "10.1109/ULTSYM.2007.37",

language = "English",

isbn = "9781424413836",

pages = "96--99",

booktitle = "2007 IEEE ULTRASONICS SYMPOSIUM PROCEEDINGS, VOLS 1-6",

publisher = "IEEE Computer Society",

note = "2007 IEEE International Ultrasonics Symposium (IUS), 2007 IEEE IUS ; Conference date: 28-10-2007 Through 31-10-2007",

url = "http://ewh.ieee.org/conf/ius_2007/",

}

Bernassau, AL, McKay, S, Hutson, D, Demore, CEM, Garcia-Gancedo, L, Button, TW, McAneny, JJ & Cochran, S 2007, Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays. in 2007 IEEE ULTRASONICS SYMPOSIUM PROCEEDINGS, VOLS 1-6. IEEE Computer Society, New York, pp. 96-99, 2007 IEEE International Ultrasonics Symposium (IUS), New York, United States, 28/10/07. https://doi.org/10.1109/ULTSYM.2007.37

TY - GEN

T1 - Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays

AU - Bernassau, A. L.

AU - McKay, S.

AU - Hutson, D.

AU - Demore, C. E. M.

AU - Garcia-Gancedo, L.

AU - Button, T. W.

AU - McAneny, J. J.

AU - Cochran, Sandy

PY - 2007

Y1 - 2007

N2 - A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires planar, parallel and smooth surfaces. This paper reports an investigation of the surface finishing of 1-3 piezocomposite material by mechanical lapping and/polishing that has demonstrated that excellent surface flatness can be obtained. Subsequently, high frequency array elements have been fabricated on these surfaces using a low temperature lift-off photolithography process. A 50 MHz linear array with 30 pm element pitch has been patterned on the lapped and polished surface of a low frequency 1-3 piezocomposite. Good electrode edge definition and electrical contact to the composite were obtained. Additionally, patterning has been demonstrated on a fine-scale composite, itself suitable for operation above 30 MHz.

AB - A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires planar, parallel and smooth surfaces. This paper reports an investigation of the surface finishing of 1-3 piezocomposite material by mechanical lapping and/polishing that has demonstrated that excellent surface flatness can be obtained. Subsequently, high frequency array elements have been fabricated on these surfaces using a low temperature lift-off photolithography process. A 50 MHz linear array with 30 pm element pitch has been patterned on the lapped and polished surface of a low frequency 1-3 piezocomposite. Good electrode edge definition and electrical contact to the composite were obtained. Additionally, patterning has been demonstrated on a fine-scale composite, itself suitable for operation above 30 MHz.

U2 - 10.1109/ULTSYM.2007.37

DO - 10.1109/ULTSYM.2007.37

M3 - Conference contribution

SN - 9781424413836

SP - 96

EP - 99

BT - 2007 IEEE ULTRASONICS SYMPOSIUM PROCEEDINGS, VOLS 1-6

PB - IEEE Computer Society

CY - New York

T2 - 2007 IEEE International Ultrasonics Symposium (IUS)

Y2 - 28 October 2007 through 31 October 2007

ER -

Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays

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