Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays

A. L. Bernassau, S. McKay, D. Hutson, C. E. M. Demore, L. Garcia-Gancedo, T. W. Button, J. J. McAneny, Sandy Cochran

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    8 Citations (Scopus)


    A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires planar, parallel and smooth surfaces. This paper reports an investigation of the surface finishing of 1-3 piezocomposite material by mechanical lapping and/polishing that has demonstrated that excellent surface flatness can be obtained. Subsequently, high frequency array elements have been fabricated on these surfaces using a low temperature lift-off photolithography process. A 50 MHz linear array with 30 pm element pitch has been patterned on the lapped and polished surface of a low frequency 1-3 piezocomposite. Good electrode edge definition and electrical contact to the composite were obtained. Additionally, patterning has been demonstrated on a fine-scale composite, itself suitable for operation above 30 MHz.

    Original languageEnglish
    Title of host publication2007 IEEE ULTRASONICS SYMPOSIUM PROCEEDINGS, VOLS 1-6
    Place of PublicationNew York
    PublisherIEEE Computer Society
    Number of pages4
    ISBN (Print)9781424413836
    Publication statusPublished - 2007
    Event2007 IEEE International Ultrasonics Symposium (IUS) - New York, United States
    Duration: 28 Oct 200731 Oct 2007


    Conference2007 IEEE International Ultrasonics Symposium (IUS)
    Abbreviated title2007 IEEE IUS
    Country/TerritoryUnited States
    CityNew York
    Internet address


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