Abstract
A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires planar, parallel and smooth surfaces. This paper reports an investigation of the surface finishing of 1-3 piezocomposite material by mechanical lapping and/polishing that has demonstrated that excellent surface flatness can be obtained. Subsequently, high frequency array elements have been fabricated on these surfaces using a low temperature lift-off photolithography process. A 50 MHz linear array with 30 pm element pitch has been patterned on the lapped and polished surface of a low frequency 1-3 piezocomposite. Good electrode edge definition and electrical contact to the composite were obtained. Additionally, patterning has been demonstrated on a fine-scale composite, itself suitable for operation above 30 MHz.
| Original language | English |
|---|---|
| Title of host publication | 2007 IEEE ULTRASONICS SYMPOSIUM PROCEEDINGS, VOLS 1-6 |
| Place of Publication | New York |
| Publisher | IEEE Computer Society |
| Pages | 96-99 |
| Number of pages | 4 |
| ISBN (Print) | 9781424413836 |
| DOIs | |
| Publication status | Published - 2007 |
| Event | 2007 IEEE International Ultrasonics Symposium (IUS) - New York, United States Duration: 28 Oct 2007 → 31 Oct 2007 http://ewh.ieee.org/conf/ius_2007/ |
Conference
| Conference | 2007 IEEE International Ultrasonics Symposium (IUS) |
|---|---|
| Abbreviated title | 2007 IEEE IUS |
| Country/Territory | United States |
| City | New York |
| Period | 28/10/07 → 31/10/07 |
| Internet address |
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