The production of surface profiles on target components

R. P. Keatch, B. Lawrenson, F. B. Lewis, T. C. Tyrrell

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    3 Citations (Scopus)

    Abstract

    This paper describes the processes developed for "mtcromachining" novel, three-dimensional structures into silicon wafer substrates. The structural detail and dimensions required are similar to those encountered in the manufacture of integrated circuits and consequently, the techniques of oxidation, photolithography, wet, and dry etching, and vacuum deposition all have the potential for use in this area df microfabrication. Although the techniques described are primarily directed towards new processes for the production of miniature free standing laser targets with varied surface profiles, these techniques are not limited to this, and can also be applied to areas such as microsensors and biomedical technology.

    Original languageEnglish
    Pages (from-to)85-89
    Number of pages5
    JournalFusion Technology
    Volume35
    Issue number2
    Publication statusPublished - 1999
    Event12th Target Fabrication Specialists Meeting, TFM-98 - Jackson Hole, United States
    Duration: 19 Apr 199823 Apr 1998

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