The production of surface profiles on target components

R. P.  Keatch; B. Lawrenson; F. B. Lewis; T. C.  Tyrrell

The production of surface profiles on target components

R. P. Keatch
, B. Lawrenson
, F. B. Lewis
, T. C. Tyrrell

Research output: Contribution to journal › Article › peer-review

Abstract

This paper describes the processes developed for "mtcromachining" novel, three-dimensional structures into silicon wafer substrates. The structural detail and dimensions required are similar to those encountered in the manufacture of integrated circuits and consequently, the techniques of oxidation, photolithography, wet, and dry etching, and vacuum deposition all have the potential for use in this area df microfabrication. Although the techniques described are primarily directed towards new processes for the production of miniature free standing laser targets with varied surface profiles, these techniques are not limited to this, and can also be applied to areas such as microsensors and biomedical technology.

Original language	English
Pages (from-to)	85-89
Number of pages	5
Journal	Fusion Technology
Volume	35
Issue number	2
Publication status	Published - 1999
Event	12th Target Fabrication Specialists Meeting, TFM-98 - Jackson Hole, United States Duration: 19 Apr 1998 → 23 Apr 1998

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title = "The production of surface profiles on target components",

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author = "Keatch, \{R. P.\} and B. Lawrenson and Lewis, \{F. B.\} and Tyrrell, \{T. C.\}",

year = "1999",

language = "English",

volume = "35",

pages = "85--89",

journal = "Fusion Technology",

issn = "0748-1896",

publisher = "American Nuclear Society",

number = "2",

note = "12th Target Fabrication Specialists Meeting, TFM-98 ; Conference date: 19-04-1998 Through 23-04-1998",

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TY - JOUR

T1 - The production of surface profiles on target components

AU - Keatch, R. P.

AU - Lawrenson, B.

AU - Lewis, F. B.

AU - Tyrrell, T. C.

PY - 1999

Y1 - 1999

N2 - This paper describes the processes developed for "mtcromachining" novel, three-dimensional structures into silicon wafer substrates. The structural detail and dimensions required are similar to those encountered in the manufacture of integrated circuits and consequently, the techniques of oxidation, photolithography, wet, and dry etching, and vacuum deposition all have the potential for use in this area df microfabrication. Although the techniques described are primarily directed towards new processes for the production of miniature free standing laser targets with varied surface profiles, these techniques are not limited to this, and can also be applied to areas such as microsensors and biomedical technology.

AB - This paper describes the processes developed for "mtcromachining" novel, three-dimensional structures into silicon wafer substrates. The structural detail and dimensions required are similar to those encountered in the manufacture of integrated circuits and consequently, the techniques of oxidation, photolithography, wet, and dry etching, and vacuum deposition all have the potential for use in this area df microfabrication. Although the techniques described are primarily directed towards new processes for the production of miniature free standing laser targets with varied surface profiles, these techniques are not limited to this, and can also be applied to areas such as microsensors and biomedical technology.

UR - http://discovery.dundee.ac.uk/portal/en/research/the-production-of-surface-profiles-on-target-components(ee0226e8-b6dd-41ab-b76c-b825bef952c5).html

M3 - Article

SN - 0748-1896

VL - 35

SP - 85

EP - 89

JO - Fusion Technology

JF - Fusion Technology

IS - 2

T2 - 12th Target Fabrication Specialists Meeting, TFM-98

Y2 - 19 April 1998 through 23 April 1998

ER -

The production of surface profiles on target components

Abstract

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