Thick film PZT transducer arrays for particle manipulation

Yongqiang Qiu, Han Wang, Aleksandrs Bolhovitins, Christine Demore, Sandy Cochran, Sylvia Gebhardt, Andreas Schonecker

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    3 Citations (Scopus)

    Abstract

    This paper reports the fabrication and evaluation of a two-dimensional thick film PZT ultrasonic transducer array operating at about 7.5 MHz for particle manipulation. All layers on the array are screen-printed and sintered on an AlO substrate without further processes or patterning. The measured dielectric constant of the PZT is 2250 ± 100, and the dielectric loss is 0.09 ± 0.005 at 10 kHz. Finite element analysis has been used to predict the behaviour of the array and impedance spectroscopy and laser vibrometry have been used to characterise its performance. The measured deflection of a single activate element is on the order of tens of nanometres with 20 V input. Particle manipulation experiments have been performed by coupling the thick film array to a capillary containing polystyrene microspheres in water.
    Original languageEnglish
    Title of host publicationUltrasonics Symposium (IUS), 2013 IEEE International
    Subtitle of host publication21-25 July 2013
    PublisherIEEE
    Pages1911-1914
    Number of pages4
    ISBN (Print)9781467356862
    DOIs
    Publication statusPublished - 2013
    EventUltrasonics Symposium (IUS), 2013 IEEE International - Prague, Czech Republic
    Duration: 21 Jul 201325 Jul 2013

    Conference

    ConferenceUltrasonics Symposium (IUS), 2013 IEEE International
    CountryCzech Republic
    CityPrague
    Period21/07/1325/07/13

      Fingerprint

    Keywords

    • 2-D array
    • particle manipulation
    • screen-printing
    • thick film

    Cite this

    Qiu, Y., Wang, H., Bolhovitins, A., Demore, C., Cochran, S., Gebhardt, S., & Schonecker, A. (2013). Thick film PZT transducer arrays for particle manipulation. In Ultrasonics Symposium (IUS), 2013 IEEE International: 21-25 July 2013 (pp. 1911-1914). IEEE. https://doi.org/10.1109/ULTSYM.2013.0487